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1. (WO2018122381) COMPONENT AND CONNECTION CARRIER
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Pub. No.: WO/2018/122381 International Application No.: PCT/EP2017/084822
Publication Date: 05.07.2018 International Filing Date: 29.12.2017
IPC:
H01L 33/62 (2010.01) ,H01L 33/58 (2010.01) ,H01L 33/52 (2010.01) ,H01L 33/48 (2010.01) ,H01L 25/16 (2006.01) ,H01L 31/0203 (2014.01) ,G06F 3/03 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
58
Optical field-shaping elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
16
the devices being of types provided for in two or more different main groups of groups H01L27/-H01L51/139
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
0203
Containers; Encapsulations
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
3
Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01
Input arrangements or combined input and output arrangements for interaction between user and computer
03
Arrangements for converting the position or the displacement of a member into a coded form
Applicants:
OSRAM OPTO SEMICONDUCTORS GMBH [DE/DE]; Leibnizstr. 4 93055 Regensburg, DE
Inventors:
HASLBECK, Stephan; DE
BECKER, Dirk; DE
Agent:
ZACCO PATENT- UND RECHTSANWALTSGESELLSCHAFT MBH; Bayerstrasse 83 80335 München, DE
Priority Data:
10 2016 125 909.830.12.2016DE
Title (EN) COMPONENT AND CONNECTION CARRIER
(FR) COMPOSANT ET SUPPORT DE BRANCHEMENTS
(DE) BAUTEIL UND ANSCHLUSSTRÄGER
Abstract:
(EN) The invention relates to a component having a connection carrier (1), a frame (2), and a covering body (3), wherein the connection carrier (1) and the covering body (3) have different coefficients of thermal expansion, a semiconductor chip (4), which is connected mechanically and electrically to the connection carrier (1), and a metal layer (5), which is arranged between the connection carrier (1) and the frame (2), wherein the covering body (3) surrounds the semiconductor chip (4) and adjoins the connection carrier (1) and the frame (2), and the metal layer (5) is not electrically conductively connected.
(FR) La présente invention concerne un composant équipé de : - un support de branchements (1), un cadre (2) et une masse d'enrobage (3), le support de branchements (1) et la masse d'enrobage (3) présentant des coefficients de dilatation thermique différents; - une puce semi-conductrice (4) qui est reliée mécaniquement et électriquement au support de branchements (1); et - une couche métallique (5) qui est disposée entre le support de branchements (1) et le cadre (2). La masse d'enrobage (3) entoure la puce semi-conductrice (4) et est limitée par le support de branchements (1) et par le cadre (2). La couche métallique (5) n'est pas branchée de manière électroconductrice.
(DE) Es wird ein Bauteil angegeben mit -einem Anschlussträger (1), einem Rahmen (2) und einem Umhüllungskörper (3), wobei der Anschlussträger (1) und der Umhüllungskörper (3) unterschiedliche thermische Ausdehnungskoeffizienten aufweisen, -einem Halbleiterchip (4), der mechanisch und elektrisch mit dem Anschlussträger (1) verbunden ist, und -einer Metallschicht (5), die zwischen dem Anschlussträger (1) und dem Rahmen (2) angeordnet ist, wobei -der Umhüllungskörper (3) den Halbleiterchip (4) umgibt und an den Anschlussträger (1) und den Rahmen (2) grenzt, und -die Metallschicht (5) nicht elektrisch leitend angeschlossen ist.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)