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1. (WO2018122336) FLUID-BASED COOLING ELEMENT FOR COOLING A HEAT GENERATING ELEMENT ARRANGED ON A PRINTED CIRCUIT BOARD
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Pub. No.: WO/2018/122336 International Application No.: PCT/EP2017/084750
Publication Date: 05.07.2018 International Filing Date: 28.12.2017
IPC:
H05K 7/20 (2006.01) ,H01L 23/473 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
46
involving the transfer of heat by flowing fluids
473
by flowing liquids
Applicants:
EKWB D.O.O. [SI/SI]; Pod Lipami 18 1218 Komenda, SI
Inventors:
TIVADAR, Niko; SI
Agent:
SCHAUMBURG UND PARTNER PATENTANWÄLTE MBB; Postbox 86 07 48 81634 München, DE
Priority Data:
16207334.029.12.2016EP
Title (EN) FLUID-BASED COOLING ELEMENT FOR COOLING A HEAT GENERATING ELEMENT ARRANGED ON A PRINTED CIRCUIT BOARD
(FR) ÉLÉMENT DE REFROIDISSEMENT À BASE DE FLUIDE POUR REFROIDIR UN ÉLÉMENT THERMOGÈNE DISPOSÉ SUR UNE CARTE DE CIRCUIT IMPRIMÉ
Abstract:
(EN) A fluid-based cooling element (10) for cooling a heat generating element (202, 204) arranged on a printed circuit board (PCB) (200) comprises a fluid chamber (42) for receiving a cooling fluid, a movable body (22) being in fluidic contact with the fluid chamber (42) on an upper side of the movable body (22), and a deformable element (20a; 20b; 20c; 20d) being in contact with the movable body (22). The movable body (22) has a base portion (24) having a first lower surface (25a) facing away from the fluid chamber (42). The deformable element (20a; 20b; 20c; 20d) is configured for movably supporting the movable body (22) such that the movable body (22) is movable towards or away from the fluid chamber (42) in a direction (P1, P2) perpendicular to an inner upper surface (43) of the fluid chamber (42), such that the position of the first lower surface (25a) of the base portion (24) of the movable body (22) is adjustable in dependence on a variable height of the heat generating element (202, 204) arranged on the printed circuit board (200).
(FR) Un élément de refroidissement à base de fluide (10) pour refroidir un élément thermogène (202, 204) disposé sur une carte de circuit imprimé (200) comprend une chambre de fluide (42) pour recevoir un fluide de refroidissement, un corps mobile (22) en contact fluidique avec la chambre de fluide (42) sur un côté supérieur du corps mobile (22), et un élément déformable (20a ; 20b ; 20c ; 20d) en contact avec le corps mobile (22). Le corps mobile (22) a une partie de base (24) ayant une première surface inférieure (25a) opposée à la chambre de fluide (42). L'élément déformable (20a ; 20b ; 20c ; 20d) est configuré pour supporter de manière mobile le corps mobile (22) de telle sorte que le corps mobile (22) est mobile vers ou à l'opposé de la chambre de fluide (42) dans une direction (P1. P2) perpendiculaire à une surface supérieure interne (43) de la chambre de fluide (42), de telle sorte que la position de la première surface inférieure (25a) de la partie de base (24) du corps mobile (22) est réglable en fonction d'une hauteur variable de l'élément thermogène (202, 204) disposé sur la carte de circuit imprimé (200).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)