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1. (WO2018122216) COPPER ELECTRODEPOSITION SOLUTION AND PROCESS FOR HIGH ASPECT RATIO PATTERNS

Pub. No.:    WO/2018/122216    International Application No.:    PCT/EP2017/084580
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Wed Dec 27 00:59:59 CET 2017
IPC: C25D 7/12
C25D 3/38
H01L 21/768
Applicants: AVENI
Inventors: RELIGIEUX, Laurianne
MEVELLEC, Vincent
THIAM, Mikaïlou
Title: COPPER ELECTRODEPOSITION SOLUTION AND PROCESS FOR HIGH ASPECT RATIO PATTERNS
Abstract:
The present invention relates to an electrolyte composition for depositing copper on a conductive surface. The composition contains a combination of 2,2'- bipyridine, imidazole, tetra-ethyl-ammonium, and a complexing agent for copper. This electrolyte makes it possible to manufacture small size copper interconnects without any void and with a filling speed that is compatible with industrial constrain. The invention also concerns a process for filling cavities with copper, and a semiconductor device that is obtained according to this process.