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1. (WO2018121752) CAMERA MODULE, MOULDED CIRCUIT BOARD ASSEMBLY THEREOF AND MANUFACTURING METHOD FOR SAME, AND ELECTRONIC DEVICE COMPRISING SAID CAMERA MODULE

Pub. No.:    WO/2018/121752    International Application No.:    PCT/CN2017/119940
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Sat Dec 30 00:59:59 CET 2017
IPC: H04N 5/225
Applicants: NINGBO SUNNY OPOTECH CO., LTD.
宁波舜宇光电信息有限公司
Inventors: CHEN, Zhenyu
陈振宇
WANG, Mingzhu
王明珠
TANAKA, Takehiko
田中武彦
GUO, Nan
郭楠
ZHAO, Bojie
赵波杰
Title: CAMERA MODULE, MOULDED CIRCUIT BOARD ASSEMBLY THEREOF AND MANUFACTURING METHOD FOR SAME, AND ELECTRONIC DEVICE COMPRISING SAID CAMERA MODULE
Abstract:
Provided in the present invention are a camera module, a moulded circuit board assembly thereof and a manufacturing method for same, and an electronic device comprising said camera module, the camera module comprising at least one optical lens, at least one photosensitive chip, and a moulded circuit board assembly, the moulded circuit board assembly comprising at least one rigid substrate and at least one connecting plate connected to the substrate, the photosensitive chip being conductively connected to the substrate, the optical lens being held in the photosensitive path of the photosensitive chip, the moulded circuit board assembly also comprising a moulded base integrated with the substrate, the moulded base surrounding the periphery of a photosensitive area of the photosensitive chip, such that the photosensitive area of the photosensitive chip corresponds to a light window of the moulded base; thus, the volume of the camera module can be reduced, such that the camera module is suitable for use in electronic devices to be made as thin as possible.