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|1. (WO2018121216) HEAT-DISSIPATING SUBSTRATE, PREPARATION METHOD AND APPLICATION THEREOF, AND ELECTRONIC COMPONENT|
|Applicants:||BYD COMPANY LIMITED
|Title:||HEAT-DISSIPATING SUBSTRATE, PREPARATION METHOD AND APPLICATION THEREOF, AND ELECTRONIC COMPONENT|
A heat-dissipating substrate, a preparation method and an application thereof, and an electronic component, related to the field of heat-dissipating substrates used in sealing electronic components. The heat-dissipating substrate comprises: a cermet composite board (1), the cermet composite board (1) being a metal layer covering a ceramic body; a metal oxide layer (2) disposed on an outer surface of the metal layer and formed integrally with the metal layer; and a welding metal layer (3) formed on at least part of an outer surface of the metal oxide layer (2), the welding metal layer (3) being used to connect a copper substrate and a carrier chip.