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1. (WO2018121216) HEAT-DISSIPATING SUBSTRATE, PREPARATION METHOD AND APPLICATION THEREOF, AND ELECTRONIC COMPONENT

Pub. No.:    WO/2018/121216    International Application No.:    PCT/CN2017/115139
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Sat Dec 09 00:59:59 CET 2017
IPC: H01L 23/14
H01L 23/373
H01L 23/498
H01L 21/48
Applicants: BYD COMPANY LIMITED
比亚迪股份有限公司
Inventors: LIAN, Junlan
连俊兰
XIONG, Yijing
熊贻婧
LIN, Hongye
林宏业
Title: HEAT-DISSIPATING SUBSTRATE, PREPARATION METHOD AND APPLICATION THEREOF, AND ELECTRONIC COMPONENT
Abstract:
A heat-dissipating substrate, a preparation method and an application thereof, and an electronic component, related to the field of heat-dissipating substrates used in sealing electronic components. The heat-dissipating substrate comprises: a cermet composite board (1), the cermet composite board (1) being a metal layer covering a ceramic body; a metal oxide layer (2) disposed on an outer surface of the metal layer and formed integrally with the metal layer; and a welding metal layer (3) formed on at least part of an outer surface of the metal oxide layer (2), the welding metal layer (3) being used to connect a copper substrate and a carrier chip.