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1. (WO2018121048) HEAT-RESISTANT PACKAGING ADHESIVE FOR HIGH-POWER LED AND MANUFACTURING METHOD THEREOF

Pub. No.:    WO/2018/121048    International Application No.:    PCT/CN2017/109033
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Fri Nov 03 00:59:59 CET 2017
IPC: C09J 163/00
C09J 163/02
C09J 11/04
H01L 33/56
Applicants: SUZHOU XING CHUANG YUAN NEW MATERIALS TECHNOLOGY CO., LTD
苏州兴创源新材料科技有限公司
Inventors: WANG, Xingzhu
王行柱
XIAO, Jun
肖军
WU, Weiping
吴卫平
XIAO, Qizhen
肖启振
Title: HEAT-RESISTANT PACKAGING ADHESIVE FOR HIGH-POWER LED AND MANUFACTURING METHOD THEREOF
Abstract:
A heat-resistant packaging adhesive for a high-power LED and a manufacturing method thereof. The adhesive is based on an epoxy resin material and contains an active toughening diluent and an active filler. The adhesive is made under certain process conditions and comprises an epoxy resin, a curing agent, and an accelerator. The epoxy resin selected is a bisphenol-A-type epoxy resin E-51 serving as a matrix resin. A mixture of epoxy resins F-44 and E-51 is used in order to improve the heat- and cold-resistant properties of a product. The F-44 contains at least 2 epoxy groups in the molecular structure thereof and as a result has high reactivity. A cured product of the F-44 has a high crosslink density, a compact structure, and good heat-resistance, mechanical strength and chemical-resistance. Materials, such as a silane coupling agent and the like, that modify and activate the surface of silicon particles are also used. The resultant packaging adhesive has suitable adhesion, longer operable time, and good mechanical processing property and does not break in a high and low temperature shock test.