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1. (WO2018121047) NANOSCALE ELECTRONIC CHIP PACKAGING MATERIAL AND PREPARATION METHOD THEREFOR
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/121047 International Application No.: PCT/CN2017/109032
Publication Date: 05.07.2018 International Filing Date: 02.11.2017
IPC:
C08L 83/12 (2006.01) ,C08G 59/42 (2006.01) ,C08G 59/50 (2006.01) ,C08G 59/68 (2006.01) ,H01L 23/29 (2006.01) ,B82Y 30/00 (2011.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
10
Block- or graft-copolymers containing polysiloxane sequences
12
containing polyether sequences
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
42
Polycarboxylic acids; Anhydrides, halides, or low-molecular-weight esters thereof
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
50
Amines
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
68
characterised by the catalysts used
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
B PERFORMING OPERATIONS; TRANSPORTING
82
NANO-TECHNOLOGY
Y
SPECIFIC USES OR APPLICATIONS OF NANO-STRUCTURES; MEASUREMENT OR ANALYSIS OF NANO-STRUCTURES; MANUFACTURE  OR TREATMENT OF NANO-STRUCTURES
30
Nano-technology for materials or surface science, e.g. nano-composites
Applicants:
苏州兴创源新材料科技有限公司 SUZHOU XING CHUANG YUAN NEW MATERIALS TECHNOLOGY CO., LTD [CN/CN]; 中国江苏省苏州 常熟经济技术开发区生态园路8号王行柱 Xingzhu Wang No.8, Ecological Park Road, Economic and Technological Development Zone, Changshu Suzhou, Jiangsu 215500, CN
Inventors:
王行柱 WANG, Xingzhu; CN
肖军 XIAO, Jun; CN
吴卫平 WU, Weiping; CN
肖启振 XIAO, Qizhen; CN
Priority Data:
201611223143.427.12.2016CN
Title (EN) NANOSCALE ELECTRONIC CHIP PACKAGING MATERIAL AND PREPARATION METHOD THEREFOR
(FR) MATÉRIAU POUR BOÎTIER DE PUCE ÉLECTRONIQUE À L'ÉCHELLE NANOMÉTRIQUE ET SON PROCÉDÉ DE PRÉPARATION
(ZH) 一种纳米级电子芯片封装材料及制备方法
Abstract:
(EN) The present invention discloses a nanoscale electronic chip packaging material and a preparation method therefor. The encapsulation material comprises 15-65% of an epoxy prepolymer, 30-70% of an epoxy modified organosilicon prepolymer nanoparticle, 5-25% of a curing agent, 0-1% of an accelerator, and 0-1% of other additives, the curing agent being a nanostructured amine and hydroxy terminated POSS. A hydrosilane and a vinyl-terminated polyoxyethylene are selected to react with a difunctional silane and a monofunctional heading agent under the action of a Pt-based catalyst, for co-hydrolysis under the action of an ammonia catalyst, then the curing agent is added, and the mixture is uniformly stirred to obtain the packaging material. The problem of poor compatibility during the preparation of other products is avoided in a product obtained using this technology, and the high-temperature resistance of the product is also improved.
(FR) La présente invention concerne un matériau pour boîtier de puce électronique à l'échelle nanométrique et son procédé de préparation. Le matériau d'encapsulation comporte 15 à 65 % d'un prépolymère époxy, 30 à 70 % d'une nanoparticule d'un prépolymère d'organosilicium modifié par un époxy, 5 à 25 % d'un agent de durcissement, 0 à 1 % d'un accélérateur et 0 à 1 % d'autres additifs, l'agent de durcissement étant une amine nanostructurée et un POSS à terminaison hydroxy. Un hydrosilane et un polyoxyéthylène à terminaison vinyle sont sélectionnés pour réagir avec un silane difonctionnel et un agent moussant monofonctionnel sous l'action d'un catalyseur à base de Pt, permettant une co-hydrolyse sous l'action d'un catalyseur à base d'ammoniac, puis l'agent de durcissement est ajouté et le mélange est agité jusqu'à ce qu'il soit uniforme pour obtenir le matériau de boîtier. Le problème de mauvaise compatibilité pendant la préparation d'autres produits est évité dans un produit obtenu par utilisation de cette technologie, la résistance du produit aux hautes températures étant de même améliorée.
(ZH) 本发明公开了一种纳米级电子芯片封装材料及制备方法,包括环氧预聚物15-65%;环氧改性有机硅预聚物纳米粒子30-70%;固化剂5-25%;促进剂0-1%;其他助剂0-1%。其中固化剂为纳米结构的端氨基和羟基POSS。通过选取含氢硅烷和端乙烯基聚氧化乙烯,在Pt催化剂作用下及与二官能团硅烷和单官能团封头剂反应,在氨催化剂的作用下进行共水解,再加入固化剂,搅拌均匀得到封装材料。采用此种技术的产品避免了其他产品在制备是存在的相容性差的问题,同时又提高了产品的耐高温性。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)