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1. (WO2018119886) OLED DISPLAY PANEL AND PACKAGING METHOD FOR OLED DISPLAY PANEL
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/119886 International Application No.: PCT/CN2016/113048
Publication Date: 05.07.2018 International Filing Date: 29.12.2016
IPC:
H01L 51/52 (2006.01) ,H01L 51/56 (2006.01) ,H01L 27/32 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52
Details of devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56
Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28
including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32
with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
Applicants:
武汉华星光电技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. [CN/CN]; 中国湖北省武汉市 东湖开发区高新大道666号生物城C5栋 Building C5, Biolake of Optics Valley, No.666 Gaoxin Avenue Wuhan East Lake High-Tech Development Zone Wuhan, Hubei 430070, CN
Inventors:
余威 YU, Wei; CN
Agent:
北京聿宏知识产权代理有限公司 YUHONG INTELLECTUAL PROPERTY LAW FIRM; 中国北京市 西城区宣武门外大街6号庄胜广场第一座西翼713室吴大建/王浩 Wu Dajian/Wang Hao West Wing, Suite 713, One Junefield Plaza 6 Xuanwumenwai Street, Xicheng District Beijing 100052, CN
Priority Data:
201611215732.826.12.2016CN
Title (EN) OLED DISPLAY PANEL AND PACKAGING METHOD FOR OLED DISPLAY PANEL
(FR) PANNEAU D'AFFICHAGE OLED ET PROCÉDÉ D'ENCAPSULATION POUR PANNEAU D'AFFICHAGE OLED
(ZH) 一种OLED显示面板及OLED显示面板的封装方法
Abstract:
(EN) An OLED display panel comprising: a substrate (1), an OLED component (2), a passivation layer (3), an embanking adhesive (4), a filler adhesive (8), a cover plate (5), and a first semipermeable membrane (6). The OLED component (2) is provided at the center of the substrate (1). The passivation layer (3) covers the OLED component (2). The embanking adhesive (4) is provided around the cover plate (5). On the side of the cover plate (5) provided with the embanking adhesive (4) and facing the substrate (1) provided with the OLED component (2), the cover plate (5), the embanking adhesive (4), and the substrate (1) constitute a sealed space. The first semipermeable membrane (6) is provided at the center of the cover plate (5) and arranged within the sealed space. The filler adhesive (8) is provided within the sealed space. The present invention implements non-defective contact between the filler adhesive (8) and the embanking adhesive (4), and prevents the filler adhesive (8) from impacting the embanking adhesive (4) and damaging the embanking adhesive (4), thus ensuring packaging effects for the OLED component (2).
(FR) L'invention concerne un panneau d'affichage OLED comprenant : un substrat (1), un composant OLED (2), une couche de passivation (3), un adhésif d'emballage (4), un adhésif de remplissage (8), une plaque de recouvrement (5), et une première membrane semi-perméable (6). Le composant OLED (2) est disposé au centre du substrat (1). La couche de passivation (3) recouvre le composant OLED (2). L'adhésif d'emballage (4) est disposé autour de la plaque de recouvrement (5). Sur le côté de la plaque de recouvrement (5) comprenant l'adhésif d'emballage (4) et faisant face au substrat (1) comprenant le composant OLED (2), la plaque de recouvrement (5), l'adhésif d'emballage (4) et le substrat (1) constituent un espace étanche. La première membrane semi-perméable (6) est disposée au centre de la plaque de recouvrement (5) et disposée à l'intérieur de l'espace étanche. L'adhésif de remplissage (8) est disposé à l'intérieur de l'espace étanche. La présente invention met en œuvre un contact non défectueux entre l'adhésif de remplissage (8) et l'adhésif d'emballage (4), et empêche l'adhésif de remplissage (8) d'entrer en contact avec l'adhésif d'emballage (4) et d'endommager l'adhésif d'emballage (4), garantissant ainsi des effets d'encapsulations pour le composant OLED (2).
(ZH) 一种OLED显示面板,包括:基板(1)、OLED器件(2)、钝化层(3)、坝胶(4)、填充胶(8)、盖板(5)和第一半透膜(6); OLED器件(2)设置在基板(1)中央,钝化层(3)覆盖在OLED器件(2)上,坝胶(4)设置在盖板(5)四周,在盖板(5)设置坝胶(4)的一侧朝向设有OLED器件(2)的基板(1)上,盖板(5)、坝胶(4)以及基板(1)构成密闭空间,第一半透膜(6)设置在盖板(5)中央且位于密闭空间内,填充胶(8)设置在密闭空间里。本发明实现了填充胶(8)与坝胶(4)的无缺陷接触,防止填充胶(8)对坝胶(4)产生冲击而损坏坝胶(4),保证了OLED器件(2)的封装效果。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)