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1. (WO2018114931) VIDEO WALL MODULE
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Pub. No.: WO/2018/114931 International Application No.: PCT/EP2017/083516
Publication Date: 28.06.2018 International Filing Date: 19.12.2017
IPC:
G09G 3/32 (2016.01) ,H01L 25/075 (2006.01) ,H01L 33/62 (2010.01) ,H01L 27/32 (2006.01)
G PHYSICS
09
EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
G
ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
3
Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
20
for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
22
using controlled light sources
30
using electroluminescent panels
32
semiconductive, e.g. diodes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
075
the devices being of a type provided for in group H01L33/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28
including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32
with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
Applicants:
OSRAM OPTO SEMICONDUCTORS GMBH [DE/DE]; Leibnizstr. 4 93055 Regensburg, DE
Inventors:
SCHWARZ, Thomas; DE
Agent:
PATENTANWALTSKANZLEI WILHELM & BECK; Prinzenstr. 13 80639 München, DE
Priority Data:
10 2016 124 983.120.12.2016DE
Title (EN) VIDEO WALL MODULE
(FR) MODULE DE MUR VIDÉO
(DE) VIDEOWANDMODUL
Abstract:
(EN) The invention relates to a video wall module having a plurality of light-emitting diode chips, wherein the light-emitting diode chips are arranged on a multi-layer printed circuit board, wherein a circuit chip is fixed to the printed circuit board, the circuit chip being connected with electrical connections of the light-emitting diode chips, in order to electrically actuate the light-emitting diode chips. According to the invention, a housing for the circuit chip is at least partially formed by the printed circuit board.
(FR) La présente invention concerne un module de mur vidéo ayant une pluralité de puces de diode électroluminescente. Les puces de diode électroluminescente sont disposées sur une carte de circuit imprimé à plusieurs couches sur laquelle est fixée une puce de commutation. La puce de commutation est reliée à des branchements électriques des puces de diode électroluminescente pour commander électriquement ces dernières. Un boîtier pour la puce de commutation est formé au moins en partie par la carte de circuit imprimé.
(DE) Es wird eine Videowand-Modul mit einer Mehrzahl von Leuchtdiodenchips vorgeschlagen, wobei die Leuchtdiodenchips an einer mehrlagigen Leiterplatte angeordnet sind, wobei ein Schaltungschip an der Leiterplatte befestigt ist, wobei der Schaltungschip mit elektrischen Anschlüssen der Leuchtdiodenchips verbunden ist, um die Leuchtdiodenchips elektrisch anzusteuern, wobei ein Gehäuse für den Schaltungschip wenigstens teilweise durch die Leiterplatte gebildet ist.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)