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1. (WO2018106951) 3D SPINRAM

Pub. No.:    WO/2018/106951    International Application No.:    PCT/US2017/065165
Publication Date: Fri Jun 15 01:59:59 CEST 2018 International Filing Date: Fri Dec 08 00:59:59 CET 2017
IPC: G11C 11/16
Applicants: INTEGRATED MAGNETOELECTRONICS CORPORATION
WUORI, Edward
SPITZER, Richard
Inventors: WUORI, Edward
SPITZER, Richard
Title: 3D SPINRAM
Abstract:
Techniques are described that enable a high-capacity memory chip based on three-dimensional SpinRAM cells and modules, and support electronics, at least some of which, are implemented with all-metal solid-state components.