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1. (WO2018106951) 3D SPINRAM
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/106951 International Application No.: PCT/US2017/065165
Publication Date: 14.06.2018 International Filing Date: 07.12.2017
IPC:
G11C 11/16 (2006.01)
Applicants: WUORI, Edward[US/US]; US
SPITZER, Richard[US/US]; US
INTEGRATED MAGNETOELECTRONICS CORPORATION[US/US]; 1214 Oxford Street Berkeley, California CA 94709, US
Inventors: WUORI, Edward; US
SPITZER, Richard; US
Agent: VILLENEUVE, Joseph M.; US
WEAVER, Jeffrey K.; US
SAMPSON, Roger S.; US
AUSTIN, James E.; US
Priority Data:
62/432,42109.12.2016US
Title (EN) 3D SPINRAM
(FR) SPINRAM 3D
Abstract: front page image
(EN) Techniques are described that enable a high-capacity memory chip based on three-dimensional SpinRAM cells and modules, and support electronics, at least some of which, are implemented with all-metal solid-state components.
(FR) L'invention concerne des techniques qui activent une puce de mémoire à capacité élevée basée sur des cellules et des modules de SpinRAM tridimensionnel, et des composants électroniques de support, dont au moins certains sont mis en oeuvre avec des composants entièrement métalliques à l'état solide.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)