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1. (WO2018106086) SEALANT COMPOSITION
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/106086    International Application No.:    PCT/KR2017/014478
Publication Date: 14.06.2018 International Filing Date: 11.12.2017
IPC:
C08L 29/10 (2006.01), C08F 16/12 (2006.01), C09D 129/10 (2006.01), H01L 51/52 (2006.01)
Applicants: LG CHEM, LTD. [KR/KR]; 128, Yeoui-daero, Yeongdeungpo-gu, Seoul 07336 (KR)
Inventors: CHOI, Kook Hyun; (KR).
KIM, Joon Hyung; (KR).
WOO, Yu Jin; (KR).
YU, Mi Lim; (KR)
Agent: DANA PATENT LAW FIRM; 5th Floor, New Wing, Gwangsung Bldg., 11, Yeoksam-ro 3-gil, Gangnam-gu, Seoul 06242 (KR)
Priority Data:
10-2016-0167798 09.12.2016 KR
Title (EN) SEALANT COMPOSITION
(FR) COMPOSITION D'AGENT D'ÉTANCHÉITÉ
(KO) 밀봉재 조성물
Abstract: front page image
(EN)The present application relates to a sealant composition, an organic electronic device, a method for evaluating the reliability of the organic electronic device, and a method for producing the organic electronic device, and provides a sealant composition which can enhance the flatness and adhesive power of an organic layer sealing an organic electronic element, thereby effectively blocking moisture or oxygen introduced into an organic electronic device from the outside, and thereby securing the life of the organic electronic device.
(FR)La présente invention concerne une composition d'agent d'étanchéité, un dispositif électronique organique, un procédé d'évaluation de la fiabilité du dispositif électronique organique et un procédé de production du dispositif électronique organique, et elle concerne une composition d'agent d'étanchéité qui peut améliorer la planéité et le pouvoir adhésif d'une couche organique scellant un élément électronique organique, bloquant ainsi efficacement l'introduction d'humidité ou d'oxygène dans un dispositif électronique organique depuis l'extérieur, et garantissant ainsi la durée de vie du dispositif électronique organique.
(KO)본 출원은 밀봉재 조성물, 유기전자장치, 상기 유기전자장치의 신뢰성 평가 방법 및 상기 유기전자장치의 제조방법에 관한 것으로서, 유기전자소자를 밀봉하는 유기층의 평탄도 및 부착력을 향상시켜 외부로부터 유기전자장치로 유입되는 수분 또는 산소를 효과적으로 차단하여 유기전자장치의 수명을 확보할 수 있는 밀봉재 조성물을 제공한다. [대표도] 도 1
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)