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1. (WO2018106011) COMPOSITION FOR ORGANIC ELECTRONIC ELEMENT ENCAPSULANT AND ENCAPSULANT FORMED USING SAME
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Pub. No.: WO/2018/106011 International Application No.: PCT/KR2017/014226
Publication Date: 14.06.2018 International Filing Date: 06.12.2017
IPC:
H01L 51/00 (2006.01) ,H01L 51/52 (2006.01) ,G03F 7/028 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52
Details of devices
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
028
with photosensitivity-increasing substances, e.g. photoinitiators
Applicants:
모멘티브퍼포먼스머티리얼스코리아 주식회사 MOMENTIVE PERFORMANCE MATERIALS KOREA CO., LTD [KR/KR]; 서울시 금천구 벚꽃로 298, 803호 803, 298, Beotkkot-ro, Geumcheon-gu, Seoul 08510, KR
Inventors:
유선 YU, Sun; KR
김난수 KIM, Nan Soo; KR
정민재 JEONG, Minjae; KR
이장희 LEE, Jang Hee; KR
Agent:
정순성 CHUNG, Soon-Sung; KR
Priority Data:
10-2016-016767809.12.2016KR
Title (EN) COMPOSITION FOR ORGANIC ELECTRONIC ELEMENT ENCAPSULANT AND ENCAPSULANT FORMED USING SAME
(FR) COMPOSITION POUR AGENT D'ENCAPSULATION D'ÉLÉMENT ÉLECTRONIQUE ORGANIQUE ET AGENT D'ENCAPSULATION FORMÉ EN UTILISANT CELLE-CI
(KO) 유기 전자 소자 봉지재용 조성물 및 이를 이용하여 형성된 봉지재
Abstract:
(EN) A composition for an encapsulant according to an embodiment of the present invention comprises: 1) a first copolymer comprising a first unit represented by chemical formula 1 above, a second unit represented by chemical formula 2 above, and a third unit represented by chemical formula 3 above; 2) a second copolymer comprising a second unit represented by chemical formula 2 above and a third unit represented by chemical formula 3 above; 3) at least one photo-initiator; and 4) a compound capable of dissolving the photo-initiator therein.
(FR) La présente invention concerne une composition pour un agent d'encapsulation contenant : 1) un premier copolymère comprenant une première unité représentée par la formule chimique 1, une seconde unité représentée par la formule chimique 2 ci-dessus, et une troisième unité représentée par la formule chimique 3; 2) un second copolymère comprenant une seconde unité représentée par la formule chimique 2 et une troisième unité représentée par la formule chimique 3; et 3) un ou plusieurs photo-initiateurs; et 4) un composé capable de dissoudre le photo-initiateur en son sein.
(KO) 본 발명에 일 실시상태에 따른 봉지재용 조성물은, 1) 상기 화학식 1로 표시되는 제1 단위, 상기 화학식 2로 표시되는 제2 단위, 및 상기 화학식 3으로 표시되는 제3 단위를 포함하는 제1 공중합체; 2) 상기 화학식 2로 표시되는 제2 단위, 및 상기 화학식 3으로 표시되는 제3 단위를 포함하는 제2 공중합체; 3) 1종 이상의 광개시제; 및 4) 상기 광개시제를 용해시킬 수 있는 화합물을 포함한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)