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1. (WO2018105901) METHOD FOR BONDING SUBSTRATE AND DISPLAY SUBSTRATE MANUFACTURED THROUGH SAME METHOD

Pub. No.:    WO/2018/105901    International Application No.:    PCT/KR2017/012568
Publication Date: Fri Jun 15 01:59:59 CEST 2018 International Filing Date: Thu Nov 09 00:59:59 CET 2017
IPC: C09J 5/00
C09D 11/101
Applicants: LG CHEM, LTD.
주식회사 엘지화학
Inventors: BACK, Seung A
백승아
KIM, Joon Hyung
김준형
Title: METHOD FOR BONDING SUBSTRATE AND DISPLAY SUBSTRATE MANUFACTURED THROUGH SAME METHOD
Abstract:
Disclosed are a substrate bonding method in which inter-substrate bonding can be achieved by light irradiation and photocuring even when an opaque substrate is used, and a display substrate manufactured through the same method. The substrate bonding method comprises the steps of: (a) printing a photo-curable adhesive ink on a lower substrate to make a pattern thereon; (b) photocuring the pattern to form a spacer on the lower substrate; (c) printing a photo-curable adhesive ink on the lower substrate including the spacer to form an adhesive layer; (d) irradiating light on the adhesive layer formed on the lower substrate; and (e) attaching an upper substrate to the adhesive layer of the lower substrate to integrate the upper substrate and the lower substrate, wherein the upper substrate and the lower substrate are transparent or opaque and are homogeneous or heterogeneous.