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1. (WO2018105846) MOUNTING STRUCTURE FOR MODULE IN ELECTRONIC DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/105846 International Application No.: PCT/KR2017/008125
Publication Date: 14.06.2018 International Filing Date: 27.07.2017
IPC:
H04M 1/02 (2006.01)
Applicants: SAMSUNG ELECTRONICS CO., LTD.[KR/KR]; 129, Samsung-ro, Yeongtong-gu Suwon-si Gyeonggi-do 16677, KR
Inventors: KIM, Hyung Dal; KR
KWON, Oh Hyuck; KR
KANG, Han Vit; KR
KIM, Jun Young; KR
KIM, Moon Kyeong; KR
KIM, Sang Seob; KR
PARK, Jung Sik; KR
JUNG, Hee Seok; KR
CHO, Sung; KR
SHIN, Heung Sik; KR
OH, Ji Woong; KR
Agent: BAE, KIM & LEE IP GROUP; 11th Floor, 343, Gangnam-daero Seocho-gu Seoul 06626, KR
Priority Data:
10-2016-016469405.12.2016KR
10-2017-003068010.03.2017KR
Title (EN) MOUNTING STRUCTURE FOR MODULE IN ELECTRONIC DEVICE
(FR) STRUCTURE DE MONTAGE POUR MODULE DANS UN DISPOSITIF ÉLECTRONIQUE
Abstract: front page image
(EN) An electronic device is provided. The electronic device includes a display including a display area and a connecting area extending from one side of the display area, a flexible printed circuit board (FPCB) connected with the connecting area, and a first module mounted on a first surface of the FPCB, where the connecting area is bent such that the first module is apart from the display to face the display.
(FR) L'invention concerne un dispositif électronique. Le dispositif électronique comprend un affichage comprenant une zone d'affichage et une zone de liaison s'étendant d'un côté de la zone d'affichage, une carte de circuit imprimé souple (FPCB) reliée à la zone de liaison, et un premier module monté sur une première surface de la FPCB, la zone de liaison étant courbée de sorte que le premier module soit séparé de l'affichage pour faire face à l'affichage.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)