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1. (WO2018105838) COMPONENT MOUNTING AND BONDING APPARATUS, AND COMPONENT MOUNTING METHOD USING SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/105838 International Application No.: PCT/KR2017/006327
Publication Date: 14.06.2018 International Filing Date: 16.06.2017
IPC:
H05K 13/04 (2006.01) ,H05K 13/08 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04
Mounting of components
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
08
Monitoring manufacture of assemblages
Applicants: HANWHA TECHWIN CO., LTD.[KR/KR]; 1204 (Seongju-dong), Changwon-daero, Seongsan-gu Changwon-si Gyeongsangnam-do 51542, KR
Inventors: SHIN, Dae Gun; KR
Agent: KASAN IP & LAW FIRM; 7th Floor, Hanwon Building 2423 Nambusunhwan-ro Seocho-gu Seoul 06719, KR
Priority Data:
10-2016-016689208.12.2016KR
Title (EN) COMPONENT MOUNTING AND BONDING APPARATUS, AND COMPONENT MOUNTING METHOD USING SAME
(FR) APPAREIL DE MONTAGE ET DE FIXATION DE COMPOSANT, ET PROCÉDÉ DE MONTAGE DE COMPOSANT L'UTILISANT
(KO) 부품 마운팅 및 본딩 장치와, 이를 이용한 부품 마운팅 방법
Abstract:
(EN) To solve the above problem, a component mounting and bonding apparatus according to an embodiment of the present invention comprises: a camera for photographing a substrate so as to obtain an image of the substrate; a unit determination part for determining, through the image, whether a unit existing on the substrate is a bad unit or a normal unit; a substrate region division part for dividing the substrate into as many substrate regions as the number of multiple gantries, on the basis of information obtained through the unit determination by the unit determination part; and a drive part for driving the multiple gantries to mount components on the divided substrate regions respectively.
(FR) Selon la présente invention, afin de résoudre le problème ci-dessus, un appareil de montage et de fixation de composant selon un mode de réalisation de la présente invention comprend : une caméra permettant de photographier un substrat de manière à obtenir une image du substrat ; une partie de détermination d'unité permettant de déterminer, par le biais de l'image, si une unité existant sur le substrat est une unité défectueuse ou une unité normale ; une partie de division en région de substrat permettant de diviser le substrat en autant de régions de substrat que le nombre de portiques multiples, sur la base d'informations obtenues par le biais de la détermination d'unité par la partie de détermination d'unité ; et une partie d'entraînement permettant d'entraîner les portiques multiples à monter des composants sur les régions de substrat divisées respectivement.
(KO) 상기 과제를 해결하기 위한 본 발명의 실시예에 따른 부품 마운팅 및 본딩 장치는 기판을 촬영하여 상기 기판에 대한 영상을 획득하는 카메라; 상기 영상을 통해 상기 기판에 존재하는 유닛이 배드 유닛 또는 정상 유닛인지 여부를 판별하는 유닛 판별부; 상기 유닛 판별부가 상기 유닛을 판별하여 획득한 정보를 토대로, 상기 기판의 영역을 복수의 갠트리의 수와 동일한 개수로 분할하는 기판 영역 분할부; 및 상기 분할된 기판의 영역에 대하여 각각 부품을 실장하도록 상기 복수의 갠트리를 구동하는 구동부를 포함한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)