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1. (WO2018105831) WAFER CARRIER THICKNESS MEASUREMENT DEVICE

Pub. No.:    WO/2018/105831    International Application No.:    PCT/KR2017/005870
Publication Date: Fri Jun 15 01:59:59 CEST 2018 International Filing Date: Tue Jun 06 01:59:59 CEST 2017
IPC: G01B 11/06
H01L 21/304
H01L 21/306
G01B 11/14
Applicants: SK SILTRON CO., LTD.
에스케이실트론 주식회사
Inventors: JUNG, Suk Jin
정석진
Title: WAFER CARRIER THICKNESS MEASUREMENT DEVICE
Abstract:
The present invention relates to a wafer carrier thickness measurement device capable of accurately measuring the thicknesses of the inner and outer peripheries of a wafer carrier in a noncontact manner. The present invention provides a wafer carrier thickness measurement device comprising: a first table installed to be rotatable and elevatable and capable of supporting a central portion of a wafer carrier; a second table, disposed outside the first table, which is rotatably installed and capable of supporting an outer peripheral portion of the wafer carrier; upper and lower sensors for measuring a distance from the upper surface to the lower surface of the wafer carrier supported by one of the first and second tables in a noncontact manner to calculate the thickness of the wafer carrier; and a sensor driving means, positioned on one side of the second table, for moving the upper and lower sensors to an upper side or a lower side of the wafer carrier supported by one of the first and second tables.