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1. (WO2018105781) SENSOR PACKAGE STRUCTURE
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Pub. No.: WO/2018/105781 International Application No.: PCT/KR2016/014343
Publication Date: 14.06.2018 International Filing Date: 08.12.2016
IPC:
H01L 25/16 (2006.01) ,H01L 25/18 (2006.01) ,H01L 27/146 (2006.01) ,H01L 31/0203 (2006.01) ,H04N 5/225 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
16
the devices being of types provided for in two or more different main groups of groups H01L27/-H01L51/139
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144
Devices controlled by radiation
146
Imager structures
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
0203
Containers; Encapsulations
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
222
Studio circuitry; Studio devices; Studio equipment
225
Television cameras
Applicants:
주식회사 레드서브마린 RED SUBMARINE CO., LTD. [KR/KR]; 경기도 용인시 기흥구 구성로279번길 25, 101호 101, 25, Guseong-ro 279beon-gil, Giheung-gu Yongin-si Gyeonggi-do 16914, KR
Inventors:
정문기 JEONG, Moon Ki; KR
Agent:
김윤선 KIM, Yoon Sun; KR
Priority Data:
Title (EN) SENSOR PACKAGE STRUCTURE
(FR) STRUCTURE DE BOÎTIER DE CAPTEUR
(KO) 센서 패키지 구조
Abstract:
(EN) A sensor package structure is disclosed. The structure according to an embodiment of the present invention comprises: a board; a printed circuit board (PCB) in an upper part of the board; a sensor unit arranged on the top surface of the PCB for detecting a certain signal; an integrated circuit (IC) unit arranged between the PCB and the board; and a connection unit for connecting a signal between the board and the PCB.
(FR) L'invention concerne une structure de boîtier de capteur. La structure selon un mode de réalisation de la présente invention comprend : une carte; une carte de circuit imprimé (PCB) dans une partie supérieure de la carte; une unité de capteur disposée sur la surface supérieure de la PCB pour détecter un certain signal; un circuit intégré (IC) disposé entre la carte de circuit imprimé et la carte; et une unité de connexion pour connecter un signal entre la carte de circuit imprimé et la carte.
(KO) 센서 패키지 구조가 개시된다. 본 발명의 일실시예의 구조는, 보드, 상기 보드 상부의 인쇄회로기판(PCB), 상기 PCB 상면에 배치되며, 소정 신호를 감지하는 센서부, 상기 PCB와 상기 보드 사이에 배치되는 집적회로(IC)부, 및 상기 보드와 상기 PCB간 신호를 연결하는 연결부를 포함한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)