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1. (WO2018105743) CURING RESIN COMPOSITION, CURED PRODUCT OF, AND CURING METHOD FOR, CURING RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE
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Pub. No.: WO/2018/105743 International Application No.: PCT/JP2017/044250
Publication Date: 14.06.2018 International Filing Date: 08.12.2017
IPC:
C08L 63/00 (2006.01) ,C08G 59/24 (2006.01) ,C08K 3/36 (2006.01) ,C08K 5/375 (2006.01) ,C08K 5/50 (2006.01) ,C08L 61/34 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
20
characterised by the epoxy compounds used
22
Di-epoxy compounds
24
carbocyclic
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
34
Silicon-containing compounds
36
Silica
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
36
Sulfur-, selenium-, or tellurium-containing compounds
372
Sulfides
375
containing six-membered aromatic rings
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
49
Phosphorus-containing compounds
50
Phosphorus bound to carbon only
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
61
Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
34
Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08L61/04, C08L61/18, and C08L61/20190
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
Applicants:
JXTGエネルギー株式会社 JXTG NIPPON OIL & ENERGY CORPORATION [JP/JP]; 東京都千代田区大手町一丁目1番2号 1-2, Otemachi 1-chome, Chiyoda-ku, Tokyo 1008162, JP
Inventors:
西谷 佳典 NISHITANI, Yoshinori; JP
南 昌樹 MINAMI, Masaki; JP
Agent:
酒井 一 SAKAI Hajime; JP
蔵合 正博 ZOGO Masahiro; JP
Priority Data:
2016-23989409.12.2016JP
Title (EN) CURING RESIN COMPOSITION, CURED PRODUCT OF, AND CURING METHOD FOR, CURING RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE
(FR) COMPOSITION DE RÉSINE DE DURCISSEMENT, PRODUIT DURCI DE, ET PROCÉDÉ DE DURCISSEMENT DESTINÉ À, LA COMPOSITION DE RÉSINE DE DURCISSEMENT, ET DISPOSITIF SEMI-CONDUCTEUR
(JA) 硬化樹脂用組成物、該硬化樹脂用組成物の硬化物及び硬化方法、並びに半導体装置
Abstract:
(EN) Provided are: a curing resin composition which can simultaneously have fast curing ability and cured product performance such as high heat resistance; a cured product of the curing resin composition; and a curing method for the curing resin composition. Also, provided is a semiconductor device which uses the curing resin composition as a sealing material. The curing resin composition contains (A) a polyfunctional benzoxazine compound having at least two benzoxazine rings, (B) a polyfunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, and (D) a phosphorus-containing curing accelerator, and optionally (E) an inorganic filler. Furthermore, the semiconductor device has a semiconductor element disposed in a cured product obtained by curing the curing resin composition containing the components (A)-(E).
(FR) La présente invention concerne : une composition de résine de durcissement qui peut simultanément présenter une capacité de durcissement rapide et une performance de produit durci telle qu’une résistance élevée à la chaleur ; un produit durci de la composition de résine de durcissement ; et un procédé de durcissement destiné à la composition de résine de durcissement. La présente invention concerne également, un dispositif semi-conducteur qui utilise la composition de résine de durcissement comme matériau d’étanchéité. La composition de résine de durcissement contient (A) un composé benzoxazine polyfonctionnel présentant au moins deux cycles benzoxazines, (B) un composé époxy polyfonctionnel présentant au moins une structure norbornane et au moins deux groupes époxy, (C) un agent de durcissement, et (D) un accélérateur de durcissement contenant du phosphore, et éventuellement (E) une charge inorganique. En outre, le dispositif semi-conducteur présente un élément semi-conducteur disposé dans un produit durci obtenu par durcissement de la composition de résine de durcissement contenant les constituants (A) à (E).
(JA) 高耐熱性等の硬化物性能と速硬化性を両立できる硬化樹脂用組成物、その硬化物、及び硬化樹脂用組成物の硬化方法を提供する。また、当該硬化樹脂用組成物を封止材として用いた半導体装置を提供する。該硬化樹脂用組成物は、(A)少なくとも2つのベンゾオキサジン環を有する多官能ベンゾオキサジン化合物、(B)少なくとも1つのノルボルナン構造及び少なくとも2つのエポキシ基を有する多官能エポキシ化合物、(C)硬化剤、及び(D)リン含有硬化促進剤を含有し、更に任意に(E)無機充填剤を含有する。また、該半導体装置は、成分(A)~(E)を含有する硬化樹脂用組成物を硬化させた硬化物中に半導体素子を設置したものである。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)