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1. (WO2018105704) LIQUID RESIN COMPOSITION
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Pub. No.: WO/2018/105704 International Application No.: PCT/JP2017/044068
Publication Date: 14.06.2018 International Filing Date: 07.12.2017
IPC:
C08L 71/02 (2006.01) ,C08J 9/04 (2006.01) ,C08K 3/26 (2006.01) ,C08K 5/09 (2006.01) ,C08K 5/42 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
71
Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
02
Polyalkylene oxides
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
9
Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
04
using blowing gases generated by a previously added blowing agent
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
18
Oxygen-containing compounds, e.g. metal carbonyls
24
Acids; Salts thereof
26
Carbonates; Bicarbonates
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
04
Oxygen-containing compounds
09
Carboxylic acids; Metal salts thereof; Anhydrides thereof
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
36
Sulfur-, selenium-, or tellurium-containing compounds
41
Compounds containing sulfur bound to oxygen
42
Sulfonic acids; Derivatives thereof
Applicants: KANEKA CORPORATION[JP/JP]; 2-3-18, Nakanoshima, Kita-ku, Osaka-shi, Osaka 5308288, JP
Inventors: KAMIYAMA Hiroshi; JP
Agent: NIIYAMA Yuichi; JP
Priority Data:
2016-23786607.12.2016JP
2017-00562617.01.2017JP
Title (EN) LIQUID RESIN COMPOSITION
(FR) COMPOSITION DE RÉSINE LIQUIDE
(JA) 液状樹脂組成物
Abstract:
(EN) Provided is a liquid resin composition which does not generate a toxic cyanogen gas when fired and is capable of maintaining flexibility even at low temperatures, and which is able to complete expansion molding in a short time by means of mixing at room temperature. A liquid resin composition which contains 100 parts by weight of a base resin (A), from 2 parts by weight to 100 parts by weight (inclusive) of a chemical foaming agent (B) and from 1 part by weight to 30 parts by weight (inclusive) of water (C). A polymer which has a hydrolyzable group bonded to a silicon atom, while containing at least one silicon group that is able to be crosslinked by forming a siloxane bond in the molecular chain, and which contains an oxyalkylene-based unit as a main chain constituting unit is used as the base resin (A). A bicarbonate (B-1) and an acidic compound (B-2) having an acid dissociation constant pKa of 3.0 or less are used as the chemical foaming agent (B). Consequently, a modified silicone resin foam which does not generate a toxic cyanogen gas when fired and is capable of maintaining flexibility even at low temperatures, while being able to be expansion molded in a short time by means of mixing at room temperature is able to be achieved.
(FR) L'invention concerne une composition de résine liquide qui ne génère pas de gaz cyanogène toxique lorsqu'elle est cuite et qui est apte à maintenir une certaine flexibilité même à basses températures, et qui est apte à réaliser un moulage par expansion en un court laps de temps au moyen d'un mélange à température ambiante. La composition de résine liquide contient 100 parties en poids d'une résine de base (A), de 2 parties en poids à 100 parties en poids (inclus) d'un agent moussant chimique (B) et de 1 partie en poids à 30 parties en poids (inclus) d'eau (C). Un polymère qui a un groupe hydrolysable lié à un atome de silicium, tout en contenant au moins un groupe silicium qui peut être réticulé par formation d'une liaison siloxane dans la chaîne moléculaire, et qui contient un motif à base d'oxyalkylène en tant que motif constitutif de la chaîne principale est utilisé en tant que résine de base (A). Un bicarbonate (BF1) et un composé acide (B-2) ayant une constante de dissociation acide pKa de 3,0 ou moins sont utilisés en tant qu'agent moussant chimique (B). Par conséquent, une mousse de résine de silicone modifiée qui ne génère pas de gaz cyanogène toxique lorsqu'elle est cuite et est apte à maintenir une certaine flexibilité même à basses températures, tout en étant apte à être moulée par expansion en un court laps de temps au moyen d'un mélange à température ambiante, peut être obtenue.
(JA) 燃焼時に有毒なシアンガスが発生せず、低温下でも柔軟性を維持でき、室温下の混合にて発泡成形が短時間で完了する液状樹脂組成物を提供する。 基材樹脂(A)100重量部、化学発泡剤(B)2重量部以上100重量部以下、水(C)1重量部以上30重量部を含む液状樹脂組成物において、基材樹脂(A)として、ケイ素原子に結合した加水分解性基を有し、シロキサン結合を形成することにより架橋し得るケイ素基を分子鎖中に少なくとも1個有し、主鎖を構成する単位がオキシアルキレン系単位からなる重合体を用い、化学発泡剤(B)として、重炭酸塩(B-1)と酸解離定数pKaが3.0以下の酸性化合物(B-2)とを用いる。これにより、燃焼時に有毒なシアンガスが発生せず、低温下でも柔軟性を維持でき、室温下の混合にて短時間で発泡成形できる変成シリコーン樹脂発泡体が得られる。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)