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1. (WO2018105620) PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE RESIN LAMINATE
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Pub. No.: WO/2018/105620 International Application No.: PCT/JP2017/043680
Publication Date: 14.06.2018 International Filing Date: 05.12.2017
IPC:
G03F 7/09 (2006.01) ,G03F 7/004 (2006.01) ,G03F 7/033 (2006.01) ,G03F 7/20 (2006.01) ,H05K 3/00 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
09
characterised by structural details, e.g. supports, auxiliary layers
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032
with binders
033
the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
Applicants:
旭化成株式会社 ASAHI KASEI KABUSHIKI KAISHA [JP/JP]; 東京都千代田区有楽町一丁目1番2号 1-1-2 Yurakucho, Chiyoda-ku, Tokyo 1000006, JP
Inventors:
松田 隆之 MATSUDA, Takayuki; JP
西澤 豪 NISHIZAWA, Go; JP
宮崎 純 MIYAZAKI, Jun; JP
Agent:
青木 篤 AOKI, Atsushi; JP
三橋 真二 MITSUHASHI, Shinji; JP
中村 和広 NAKAMURA, Kazuhiro; JP
齋藤 都子 SAITO, Miyako; JP
三間 俊介 MIMA, Shunsuke; JP
Priority Data:
2016-23755607.12.2016JP
2017-05885524.03.2017JP
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE RESIN LAMINATE
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE ET STRATIFIÉ DE RÉSINE PHOTOSENSIBLE
(JA) 感光性樹脂組成物及び感光性樹脂積層体
Abstract:
(EN) Provided is a photosensitive resin laminate that is capable of ensuring high resolution and favorable line width reproducibility even when a deviation in focusing occurs during exposure. This photosensitive resin laminate is provided with a support film and a photosensitive resin composition layer that comprises a photosensitive resin composition and that is formed on said support film, wherein when a 5-mm square piece is cut out at arbitrarily-defined ten locations in the support film, the number of fine particles that have a size of not less than 1.5 μm but less than 4.5 μm and that are included in each of the pieces is 0-200 on average across the ten locations.
(FR) L'invention concerne un stratifié de résine photosensible pouvant assurer une haute résolution et une reproductibilité de largeur de ligne satisfaisante même lorsqu'un écart de focalisation apparaît pendant une exposition. Le stratifié de résine photosensible d'après l'invention est pourvu d'un film de support et d'une couche en une composition de résine photosensible qui contient une composition de résine photosensible et qui est formée sur ledit film de support. Lorsqu'une pièce carrée de 5 mm est découpée en dix emplacements définis arbitrairement dans le film de support, le nombre de particules fines d'une taille supérieure ou égale à 1,5 µm et inférieure à 4,5 µm comprises dans chacune des pièces se situe entre 0 à 200 en moyenne sur les dix emplacements.
(JA) 露光時の焦点がずれたときであっても、高解像性及び良好な線幅再現性を発現する感光性樹脂積層体を提供する。支持フィルムと、該支持フィルム上に形成された感光性樹脂組成物を含む感光性樹脂組成物層と、を備える感光性樹脂積層体であって、支持フィルムの任意の10箇所において一辺5mmの正方形状の小片を切り出したときの、各小片中に含まれる1.5μm以上4.5μm未満の微粒子の数が、前記10箇所平均で0~200個である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)