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1. (WO2018105613) TAPE FOR SEMICONDUCTOR PROCESSING

Pub. No.:    WO/2018/105613    International Application No.:    PCT/JP2017/043649
Publication Date: Fri Jun 15 01:59:59 CEST 2018 International Filing Date: Wed Dec 06 00:59:59 CET 2017
IPC: H01L 21/301
B23K 26/53
B32B 7/10
B32B 27/00
C09J 7/20
C09J 201/00
H01L 21/304
Applicants: FURUKAWA ELECTRIC CO., LTD.
古河電気工業株式会社
Inventors: YOKOI, Hirotoki
横井 啓時
MATSUBARA, Yukihiro
松原 侑弘
Title: TAPE FOR SEMICONDUCTOR PROCESSING
Abstract:
A tape for semiconductor processing, which is used for the purpose of dividing an adhesive layer along a semiconductor chip by means of expansion, and which sequentially comprises a substrate film, a gluing agent layer and an adhesive layer in this order. This tape for semiconductor processing is configured such that: the substrate film has a stress at 5% elongation of 5 MPa or more in both MD and TD, a tensile strength at 5% elongation of 10-30 N/25 mm in both MD and TD, and a thickness of 70-150 μm; and the adhesive layer has a thickness of 40 μm or more and a storage elastic modulus at 25°C of 2,000 MPa or less.