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|1. (WO2018105613) TAPE FOR SEMICONDUCTOR PROCESSING|
|Applicants:||FURUKAWA ELECTRIC CO., LTD.
|Title:||TAPE FOR SEMICONDUCTOR PROCESSING|
A tape for semiconductor processing, which is used for the purpose of dividing an adhesive layer along a semiconductor chip by means of expansion, and which sequentially comprises a substrate film, a gluing agent layer and an adhesive layer in this order. This tape for semiconductor processing is configured such that: the substrate film has a stress at 5% elongation of 5 MPa or more in both MD and TD, a tensile strength at 5% elongation of 10-30 N/25 mm in both MD and TD, and a thickness of 70-150 μm; and the adhesive layer has a thickness of 40 μm or more and a storage elastic modulus at 25°C of 2,000 MPa or less.