Provided are a vibratory feeding method and device for electronic components with which cracking or chipping is less likely to occur in the electronic components being handled and with which the filling rate of the electronic components into storage holes can be easily increased. A storage plate (2) having a plurality of storage holes (4), the respective openings (5) of which are distributed over a main surface (6), is prepared, and a plurality of electronic components are loaded onto the main surface (6) of the storage plate (2). While the main surface (6) of the storage plate (2) is maintained in a horizontal orientation, horizontal vibrations in the X-axis direction and/or the Y-axis direction and vertical vibrations in the Z-axis direction are applied to the storage plate (2). The horizontal vibration and the vertical vibration have the same vibration frequency as each other and have a predetermined phase difference therebetween. By vibrating the storage plate (2) in this manner, the plurality of electronic components are fed into the storage holes (4) while being moved over the main surface 6 of the storage plate (2).