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1. (WO2018105543) HIGH-MOLECULAR-WEIGHT COMPOUND CONTAINING CARBOXYLIC ACID GROUP, AND ADHESIVE AGENT COMPOSITION CONTAINING SAME

Pub. No.:    WO/2018/105543    International Application No.:    PCT/JP2017/043420
Publication Date: Fri Jun 15 01:59:59 CEST 2018 International Filing Date: Tue Dec 05 00:59:59 CET 2017
IPC: C08G 63/91
C08G 63/12
C09J 7/00
C09J 167/00
H05K 3/38
Applicants: TOYOBO CO., LTD.
東洋紡株式会社
Inventors: SHIBA, Takuya
芝 拓也
ITO, Takeshi
伊藤 武
Title: HIGH-MOLECULAR-WEIGHT COMPOUND CONTAINING CARBOXYLIC ACID GROUP, AND ADHESIVE AGENT COMPOSITION CONTAINING SAME
Abstract:
The purpose of the present invention is to provide an adhesive agent composition which has highly superior wet heat resistance and can be applied to a lead-free solder under high humidity conditions while keeping the good adhesiveness thereof to various plastic films, metals such as copper, aluminum and stainless steel and a glass epoxy. A high-molecular-weight compound containing a carboxylic acid group, which contains, as copolymerization components, at least a high-molecular-weight polyol (A) having a number average molecular weight (Mn1) of 7,000 or more, a high-molecular-weight polyol (B) different from the high-molecular-weight polyol (A) and having a number average molecular weight (Mn2) of 1,000 or more, and a tetracarboxylic dianhydride, wherein the following requirements (1) to (2) are satisfied: (1) the number average molecular weight (Mn1) of the high-molecular-weight polyol (A) is largest among the copolymerization components; and (2) the number average molecular weight (Mn3) of the high-molecular-weight compound containing a carboxylic acid group is up to 1.7 times larger than the number average molecular weight (Mn1) of the high-molecular-weight polyol (A).