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1. (WO2018105465) ELECTRONIC CIRCUIT BOARD AND POWER CONVERSION DEVICE
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Pub. No.: WO/2018/105465 International Application No.: PCT/JP2017/042886
Publication Date: 14.06.2018 International Filing Date: 29.11.2017
IPC:
H05K 3/46 (2006.01) ,H01F 30/10 (2006.01) ,H02M 3/28 (2006.01) ,H05K 1/02 (2006.01) ,H05K 1/16 (2006.01) ,H05K 7/20 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
F
MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
30
Fixed transformers not covered by group H01F19/68
06
characterised by the structure
10
Single-phase transformers
H ELECTRICITY
02
GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
M
APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
3
Conversion of dc power input into dc power output
22
with intermediate conversion into ac
24
by static converters
28
using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
16
incorporating printed electric components, e.g. printed resistor, capacitor, inductor
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants:
三菱電機株式会社 MITSUBISHI ELECTRIC CORPORATION [JP/JP]; 東京都千代田区丸の内二丁目7番3号 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008310, JP
Inventors:
中島 浩二 NAKAJIMA, Koji; JP
白形 雄二 SHIRAKATA, Yuji; JP
藤井 健太 FUJII, Kenta; JP
佐藤 翔太 SATO, Shota; JP
Agent:
曾我 道治 SOGA, Michiharu; JP
梶並 順 KAJINAMI, Jun; JP
上田 俊一 UEDA, Shunichi; JP
Priority Data:
2016-23913709.12.2016JP
Title (EN) ELECTRONIC CIRCUIT BOARD AND POWER CONVERSION DEVICE
(FR) CARTE DE CIRCUIT ÉLECTRONIQUE ET DISPOSITIF DE CONVERSION DE PUISSANCE
(JA) 電子回路基板、電力変換装置
Abstract:
(EN) In this electronic circuit board of a power conversion device or the like, thermal interference between mounted components is reduced in order to closely arrange the mounted components including a semiconductor element to be mounted on a multilayer printed board and including a magnetic component that is formed by a magnetic core and a coil pattern made of a copper foil of the printed board. When viewed in a direction perpendicular to the main surface of the multilayer printed board, a heat dissipation pattern which is connected to a screw fixing part disposed around the semiconductor element and the coil pattern is provided between and around the semiconductor element and the coil pattern, and the screw fixing part is connected to a cooler so as to provide thermal conductivity and electric conductivity therebetween.
(FR) Dans cette carte de circuit électronique d'un dispositif de conversion de puissance ou analogue, l'interférence thermique entre les composants montés est réduite afin d'agencer étroitement les composants montés y compris un élément semi-conducteur à monter sur une carte de circuit imprimé multicouche et y compris un composant magnétique qui est constitué d'un noyau magnétique et d'un motif de bobine constitué d'une feuille de cuivre de la carte de circuit imprimé. Vu dans une direction perpendiculaire à la surface principale de la carte de circuit imprimé multicouche, un motif de dissipation de chaleur qui est connecté à une partie de fixation de vis disposée autour de l'élément semi-conducteur et du motif de bobine est disposé entre et autour de l'élément semi-conducteur et du motif de bobine, et la partie de fixation de vis est connectée à un refroidisseur de façon à fournir une conductivité thermique et une conductivité électrique entre ceux-ci.
(JA) 電力変換装置等の電子回路基板において、多層のプリント基板に実装する半導体素子、およびプリント基板の銅箔からなるコイルパターンと磁性コアにより形成される磁性部品を含む実装部品を近接配置するために、実装部品の間の熱干渉を抑制する。多層のプリント基板の主面に垂直な方向からみたときに、半導体素子とコイルパターンの周囲に配置されるねじ固定部に接続される放熱パターンを半導体素子とコイルパターンの間および周囲に設け、ねじ固定部を冷却器と熱伝導性、導電性を持たせて接続する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)