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1. (WO2018105409) CIRCUIT DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/105409 International Application No.: PCT/JP2017/042148
Publication Date: 14.06.2018 International Filing Date: 24.11.2017
IPC:
H05K 1/02 (2006.01) ,H05K 7/06 (2006.01) ,H05K 7/20 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
02
Arrangements of circuit components or wiring on supporting structure
06
on insulating boards
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants: AUTONETWORKS TECHNOLOGIES, LTD.[JP/JP]; 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503, JP
SUMITOMO WIRING SYSTEMS, LTD.[JP/JP]; 1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie 5108503, JP
SUMITOMO ELECTRIC INDUSTRIES, LTD.[JP/JP]; 5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 5410041, JP
Inventors: KITA Yukinori; JP
Agent: AKATSUKI UNION PATENT FIRM; 5th Floor, Nittochi Nagoya Bldg., 1-1, Sakae 2-chome, Naka-ku, Nagoya-shi, Aichi 4600008, JP
Priority Data:
2016-23575705.12.2016JP
Title (EN) CIRCUIT DEVICE
(FR) DISPOSITIF DE CIRCUIT
(JA) 回路装置
Abstract:
(EN) A circuit device 10 is provided with: a circuit constituent body 11; a heat sink 30, which is disposed overlapping the circuit constituent body 11, and which dissipates heat transferred from the circuit constituent body 11; and an insulating second adhesive sheet 40, which is disposed between the circuit constituent body 11 and the heat sink 30, and which adheres the circuit constituent body 11 and the heat sink 30 to each other. With such configuration, insulation between the circuit constituent body 11 and the heat sink 30 can be easily and reliably ensured using the second adhesive sheet 40, the thickness of which can be easily managed compared with a liquid adhesive. Furthermore, compared with a configuration wherein an adhesive is applied twice, the manufacture step can be simplified and the manufacturing cost can be reduced.
(FR) La présente invention concerne un dispositif de circuit (10) qui est pourvu : d'un corps de composant de circuit (11) ; d'un dissipateur thermique (30), qui est disposé de manière à chevaucher le corps de composant de circuit (11), et qui dissipe la chaleur transférée depuis le corps de composant de circuit (11) ; et d'une seconde feuille adhésive isolante (40), qui est disposée entre le corps de composant de circuit (11) et le dissipateur thermique (30), et qui fait adhérer le corps de composant de circuit (11) et le dissipateur thermique (30) l'un à l'autre. Au moyen d'une telle configuration, l'isolation entre le corps de composant de circuit (11) et le dissipateur thermique (30) peut être assurée facilement et de manière fiable à l'aide de la seconde feuille adhésive (40), dont l'épaisseur peut être facilement gérée par comparaison avec un adhésif liquide. En outre, par comparaison avec une conception dans laquelle un adhésif est appliqué deux fois, l'étape de fabrication peut être simplifiée et les coûts de fabrication peuvent être réduits.
(JA) 回路装置10は、回路構成体11と、回路構成体11に重ねて配置され、回路構成体11からの熱を放熱するヒートシンク30と、回路構成体11とヒートシンク30との間に介在して回路構成体11とヒートシンク30とを接着する絶縁性の第2接着シート40とを備える。このような構成によれば、液状の接着剤と比較して厚さの管理が容易な第2接着シート40を用いることにより、回路構成体11とヒートシンク30との絶縁性を容易かつ確実に確保できる。また、接着剤を二度塗りする構成と比較して、製造工程を簡素化し、製造コストを低減することができる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)