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1. (WO2018105388) SN PLATING MATERIAL AND PRODUCTION METHOD THEREFOR

Pub. No.:    WO/2018/105388    International Application No.:    PCT/JP2017/041827
Publication Date: Fri Jun 15 01:59:59 CEST 2018 International Filing Date: Wed Nov 22 00:59:59 CET 2017
IPC: C25D 5/12
C25D 3/22
C25D 5/50
C25D 7/00
H01R 13/03
Applicants: DOWA METALTECH CO., LTD.
DOWAメタルテック株式会社
Inventors: NARIEDA Hiroto
成枝 宏人
SONODA Yuta
園田 悠太
DOI Tatsuhiro
土井 龍大
TOMIYA Takao
冨谷 隆夫
Title: SN PLATING MATERIAL AND PRODUCTION METHOD THEREFOR
Abstract:
Provided are: a Sn plating material which has a Zn plating layer formed at a surface thereof, and which when used as a material for a terminal which is connected to an electric wire formed of aluminum or an aluminum alloy by pressure-attachment processing, such as crimping, has good corrosion resistance, and good adhesion of the Zn plating layer formed on the surface, without performing any treatment on the connection portion during the pressure-attachment processing; and a production method for the Sn plating material. This Sn plating material has a Sn-containing layer 12 formed on a surface of a substrate 10 formed of copper or a copper alloy, wherein the Sn-containing layer 12 is formed of a Cu-Sn alloy layer 121 and a Sn layer 122 that comprises Sn, that has a thickness of 5 μm or less, and that is formed on a surface of the Cu-Sn alloy layer, a Ni plating layer 14 is formed on a surface of the Sn-containing layer 12, and a Zn plating layer 16 is formed as the outermost layer on a surface of the Ni plating layer 14.