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1. (WO2018105364) ELECTRONIC COMPONENT
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/105364 International Application No.: PCT/JP2017/041617
Publication Date: 14.06.2018 International Filing Date: 20.11.2017
IPC:
H01G 4/40 (2006.01) ,H01G 4/35 (2006.01)
Applicants: MURATA MANUFACTURING CO., LTD.[JP/JP]; 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors: TOMOHIRO, Takashi; JP
FUJIMOTO, Kazumasa; JP
NOBUTA, Tomoki; JP
Agent: ONDA, Makoto; JP
ONDA, Hironori; JP
Priority Data:
2016-23579105.12.2016JP
Title (EN) ELECTRONIC COMPONENT
(FR) COMPOSANT ÉLECTRONIQUE
(JA) 電子部品
Abstract: front page image
(EN) This electronic component comprises: a component element 20; and a first external electrode 61 and a second external electrode 62, which respectively cover end faces 21, 22 of the component element 20. The component element 20 comprises an element main body 30 and a magnetic part 50 that covers the element main body 30. The element main body 30 comprises a linear internal conductor 31, a dielectric layer 35 that covers a part of the circumference of the internal conductor 31, and a conductor layer 40 that is formed so as to cover the dielectric layer 35.
(FR) L'invention concerne un composant électronique comprenant : un élément de composant 20; et une première électrode externe 61 et une seconde électrode externe 62, qui couvrent respectivement des faces d'extrémité 21, 22 de l'élément de composant 20. L'élément de composant 20 comprend un corps principal d'élément 30 et une partie magnétique 50 qui recouvre le corps principal d'élément 30. Le corps principal d'élément 30 comprend un conducteur interne linéaire 31, une couche diélectrique 35 qui recouvre une partie de la circonférence du conducteur interne 31, et une couche conductrice 40 qui est formée de manière à recouvrir la couche diélectrique 35.
(JA) 電子部品は、部品素体20と、部品素体20の端面21,22を覆う第1外部電極61及び第2外部電極62を有している。部品素体20は、素子本体30と、素子本体30を覆う磁性体部50を有している。素子本体30は、線状の内部導体31と、内部導体31の一部の周囲を覆う誘電体層35と、誘電体層35を覆うように形成された導体層40とを有している。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)