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1. (WO2018105348) METHOD FOR MANUFACTURING MODULE

Pub. No.:    WO/2018/105348    International Application No.:    PCT/JP2017/041229
Publication Date: Fri Jun 15 01:59:59 CEST 2018 International Filing Date: Fri Nov 17 00:59:59 CET 2017
IPC: H01F 41/04
H01F 17/00
H05K 1/16
H05K 3/20
Applicants: NITTO DENKO CORPORATION
日東電工株式会社
Inventors: FURUKAWA, Yoshihiro
古川 佳宏
OKUMURA, Keisuke
奥村 圭佑
Title: METHOD FOR MANUFACTURING MODULE
Abstract:
This method for manufacturing a module is provided with: a first step for preparing a seed layer that is disposed on one surface of a first peeling layer, said one surface being in the thickness direction; a second step for forming, by means of plating using power supplied from the seed layer, a conductor pattern on one surface of the seed layer, said one surface being in the thickness direction; a third step for pressing the conductor pattern into a first adhesive layer containing first magnetic particles; and a fourth step for exposing the conductor pattern, and the other surface of the first adhesive layer, said the other surface being in the thickness direction.