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1. (WO2018105307) ELECTRONIC COMPONENT
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Pub. No.: WO/2018/105307 International Application No.: PCT/JP2017/040504
Publication Date: 14.06.2018 International Filing Date: 10.11.2017
IPC:
H01L 23/00 (2006.01) ,H05K 9/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
矢▲崎▼ 浩和 YAZAKI Hirokazu; JP
Agent:
特許業務法人 楓国際特許事務所 KAEDE PATENT ATTORNEYS' OFFICE; 大阪府大阪市中央区農人橋1丁目4番34号 1-4-34, Noninbashi, Chuo-ku, Osaka-shi, Osaka 5400011, JP
Priority Data:
2016-23567805.12.2016JP
Title (EN) ELECTRONIC COMPONENT
(FR) COMPOSANT ÉLECTRONIQUE
(JA) 電子部品
Abstract:
(EN) The present invention effectively suppresses radiation of low-frequency noise from an electronic component. This electronic component (10) is provided with a substrate (20), surface mount components (51, 52), a non-magnetic resin layer (60), a metal shield layer (70) and a magnetic shield layer (80). The substrate (20) has a first main surface and a second main surface, which are opposite to each other, while comprising a magnetic layer (201). The surface mount components (51, 52) are mounted on the first main surface of the substrate (20). The non-magnetic resin layer (60) covers the surface mount components (51, 52). The metal shield layer (70) covers the non-magnetic resin layer (60). The magnetic shield layer (80) covers the entire surface of the metal shield layer (70).
(FR) La présente invention supprime efficacement le rayonnement de bruit basse fréquence à partir d'un composant électronique. Ce composant électronique comprend un substrat (20), des composants de montage en surface (51, 52), une couche de résine non magnétique (60), une couche de blindage métallique (70) et une couche de blindage magnétique (80). Le substrat (20) a une première surface principale et une seconde surface principale, qui sont opposées l'une à l'autre, tout en comprenant une couche magnétique (201). Les composants de montage en surface (51, 52) sont montés sur la première surface principale du substrat (20). La couche de résine non magnétique (60) recouvre les composants de montage en surface (51, 52). La couche de blindage métallique (70) recouvre la couche de résine non magnétique (60). La couche de blindage magnétique (80) recouvre la totalité de la surface de la couche de blindage métallique (70).
(JA) 電子部品からの低周波ノイズの輻射を効果的に抑制する。電子部品(10)は、基板(20)、表面実装部品(51、52)、非磁性樹脂層(60)、金属シールド層(70)、および、磁性シールド層(80)を備える。基板(20)は、互いに対向する第1主面と第2主面とを有し、磁性体層(201)を含む。表面実装部品(51、52)は、基板(20)の第1主面に実装されている。非磁性樹脂層(60)は、表面実装部品(51、52)を覆っている。金属シールド層(70)は、非磁性樹脂層(60)を覆っている。磁性シールド層(80)は、金属シールド層(70)の全面を覆っている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)