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1. (WO2018105306) DOUBLE-SIDE POLISHING DEVICE CARRIER, DOUBLE-SIDE POLISHING DEVICE, AND DOUBLE-SIDE POLISHING METHOD

Pub. No.:    WO/2018/105306    International Application No.:    PCT/JP2017/040503
Publication Date: Fri Jun 15 01:59:59 CEST 2018 International Filing Date: Sat Nov 11 00:59:59 CET 2017
IPC: H01L 21/304
B24B 37/08
B24B 37/28
Applicants: SHIN-ETSU HANDOTAI CO.,LTD.
信越半導体株式会社
Inventors: TANAKA Yuki
田中 佑宜
KITAZUME Daichi
北爪 大地
Title: DOUBLE-SIDE POLISHING DEVICE CARRIER, DOUBLE-SIDE POLISHING DEVICE, AND DOUBLE-SIDE POLISHING METHOD
Abstract:
The present invention provides a double-side polishing device carrier for a double-side polishing device which performs double-side polishing of a semiconductor silicon wafer, wherein the double-side polishing device carrier is disposed between upper and lower surface plates each having polishing cloth attached thereto, and is formed with holding holes for holding the semiconductor silicon wafer being sandwiched between the upper and lower surface plates during polishing. The double-side polishing device carrier is made of resin, has an average contact angle value of not less than 45° and not more than 60° with respect to pure water on front and back surfaces that contact the polishing cloth, wherein a difference between the average contact angle values on a front surface and a back surface is not more than 5°. Thus, there are provided a double-side polishing device carrier which uses a resin carrier and with which the rate of polishing of a semiconductor silicon wafer can be improved, and a double-side polishing device and a double-side polishing method using the same.