Search International and National Patent Collections

1. (WO2018105113) SUBSTRATE PROCESSING DEVICE, COOLING UNIT, AND HEAT INSULATING STRUCTURE

Pub. No.:    WO/2018/105113    International Application No.:    PCT/JP2016/086775
Publication Date: Fri Jun 15 01:59:59 CEST 2018 International Filing Date: Sat Dec 10 00:59:59 CET 2016
IPC: H01L 21/31
C23C 16/44
H01L 21/22
Applicants: KOKUSAI ELECTRIC CORPORATION
株式会社KOKUSAI ELECTRIC
Inventors: KOSUGI, Tetsuya
小杉 哲也
MURATA, Hitoshi
村田 等
YAMAGUCHI, Takatomo
山口 天和
SAIDO, Shuhei
西堂 周平
Title: SUBSTRATE PROCESSING DEVICE, COOLING UNIT, AND HEAT INSULATING STRUCTURE
Abstract:
A configuration provided with: an intake pipe which is provided for each zone to supply a gas for cooling a reaction pipe; a control valve with which the intake pipe is provided to adjust the flow volume of the gas; a buffer portion in which the gas supplied from the intake pipe is temporarily accumulated; and opening portions which are provided in the zone at regular intervals in a circumferential direction so as to blow out the gas accumulated in the buffer portion toward the reaction pipe. In the configuration, the flow volume of the gas introduced into the intake pipe is set in accordance with a length proportion in the vertical direction of the zone, thereby adjusting the flow volume and flow velocity of the gas, which is ejected out of the opening portions toward the reaction pipe by opening or closing the control valve.