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1. (WO2018105071) THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING SAME, PREPREG, LAMINATE, AND PRINTED WIRING BOARD

Pub. No.:    WO/2018/105071    International Application No.:    PCT/JP2016/086457
Publication Date: Fri Jun 15 01:59:59 CEST 2018 International Filing Date: Thu Dec 08 00:59:59 CET 2016
IPC: C08G 59/42
B32B 15/08
C08G 59/62
C08J 5/24
C08K 9/06
C08L 63/00
H05K 1/03
Applicants: HITACHI CHEMICAL COMPANY, LTD.
日立化成株式会社
Inventors: KUSHIDA, Keisuke
串田 圭祐
SHIMIZU, Hiroshi
清水 浩
KAKITANI, Minoru
垣谷 稔
SHIRAOKAWA, Yoshikatsu
白男川 芳克
KANEKO, Tatsunori
金子 辰徳
Title: THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING SAME, PREPREG, LAMINATE, AND PRINTED WIRING BOARD
Abstract:
Provided is a thermosetting resin composition comprising: (A) a maleimide compound; (B) an epoxy resin having at least two epoxy groups in a molecule; (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from maleic anhydride; (D) silica processed with an aminosilane coupling agent; and (E) a flame retardant dispersion.