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1. (WO2018105057) RESIN COMPOSITION FOR SEALING, CURED PRODUCT, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/105057 International Application No.: PCT/JP2016/086387
Publication Date: 14.06.2018 International Filing Date: 07.12.2016
IPC:
C08L 63/00 (2006.01) ,C08G 59/20 (2006.01) ,C08G 59/56 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01)
Applicants: HITACHI CHEMICAL COMPANY, LTD.[JP/JP]; 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606, JP
Inventors: TAKEUCHI, Yuma; JP
TAKAHASHI, Hisato; JP
Agent: TAIYO, NAKAJIMA & KATO; 3-17, Shinjuku 4-chome, Shinjuku-ku, Tokyo 1600022, JP
Priority Data:
Title (EN) RESIN COMPOSITION FOR SEALING, CURED PRODUCT, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE
(FR) COMPOSITION DE RÉSINE POUR SCELLEMENT, ARTICLE DURCI, ET DISPOSITIF DE COMPOSANT ÉLECTRONIQUE AINSI QUE PROCÉDÉ DE FABRICATION DE CELUI-CI
(JA) 封止用樹脂組成物、硬化物、電子部品装置及び電子部品装置の製造方法
Abstract:
(EN) Disclosed is a resin composition for sealing, comprising: (A) an epoxy resin; (B) a curing agent containing at least one amino group; (C) a resin having a phenoxy structure; and (D) an inorganic filler.
(FR) L'invention concerne une composition de résine pour scellement qui contient (A) une résine époxy, (B) un agent de durcissement possédant au moins un groupe amino, (C) une résine possédant une structure phénoxy, et (D) une charge inorganique.
(JA) (A)エポキシ樹脂、(B)アミノ基を少なくとも1つ有する硬化剤、(C)フェノキシ構造を有する樹脂及び(D)無機充填材を含む封止用樹脂組成物。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)