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1. (WO2018105057) RESIN COMPOSITION FOR SEALING, CURED PRODUCT, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE

Pub. No.:    WO/2018/105057    International Application No.:    PCT/JP2016/086387
Publication Date: Fri Jun 15 01:59:59 CEST 2018 International Filing Date: Thu Dec 08 00:59:59 CET 2016
IPC: C08L 63/00
C08G 59/20
C08G 59/56
H01L 23/29
H01L 23/31
Applicants: HITACHI CHEMICAL COMPANY, LTD.
日立化成株式会社
Inventors: TAKEUCHI, Yuma
竹内 勇磨
TAKAHASHI, Hisato
高橋 寿登
Title: RESIN COMPOSITION FOR SEALING, CURED PRODUCT, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE
Abstract:
Disclosed is a resin composition for sealing, comprising: (A) an epoxy resin; (B) a curing agent containing at least one amino group; (C) a resin having a phenoxy structure; and (D) an inorganic filler.