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1. (WO2018105056) RESIN COMPOSITION FOR SEALING, CURED PRODUCT, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE
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Pub. No.: WO/2018/105056 International Application No.: PCT/JP2016/086386
Publication Date: 14.06.2018 International Filing Date: 07.12.2016
IPC:
C08L 63/00 (2006.01) ,C08G 59/56 (2006.01) ,C08K 5/057 (2006.01) ,C08K 5/10 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
50
Amines
56
together with other curing agents
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
04
Oxygen-containing compounds
05
Alcohols; Metal alcoholates
057
Metal alcoholates
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
04
Oxygen-containing compounds
10
Esters; Ether-esters
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
Applicants:
日立化成株式会社 HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 東京都千代田区丸の内一丁目9番2号 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606, JP
Inventors:
竹内 勇磨 TAKEUCHI, Yuma; JP
高橋 寿登 TAKAHASHI, Hisato; JP
江連 智喜 EZURE, Tomoki; JP
Agent:
特許業務法人太陽国際特許事務所 TAIYO, NAKAJIMA & KATO; 東京都新宿区新宿4丁目3番17号 3-17, Shinjuku 4-chome, Shinjuku-ku, Tokyo 1600022, JP
Priority Data:
Title (EN) RESIN COMPOSITION FOR SEALING, CURED PRODUCT, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE
(FR) COMPOSITION DE RÉSINE POUR SCELLEMENT, ARTICLE DURCI, ET DISPOSITIF DE COMPOSANT ÉLECTRONIQUE AINSI QUE PROCÉDÉ DE FABRICATION DE CELUI-CI
(JA) 封止用樹脂組成物、硬化物、電子部品装置及び電子部品装置の製造方法
Abstract:
(EN) Disclosed is a resin composition for sealing, comprising: (A) an epoxy resin; (B) a curing agent containing at least one amino group; (C) a metal complex and/or a metal compound; and (D) an inorganic filler.
(FR) L'invention concerne une composition de résine pour scellement qui contient (A) une résine époxy, (B) un agent de durcissement possédant au moins un groupe amino, (C) un complexe métallique et/ou un composé métal, et (D) une charge inorganique.
(JA) (A)エポキシ樹脂、(B)アミノ基を少なくとも1つ有する硬化剤、(C)金属錯体及び金属化合物の少なくとも一方、ならびに(D)無機充填材を含む封止用樹脂組成物。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)