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1. (WO2018105000) PRINTED WIRING BOARD, AIR CONDITIONER, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

Pub. No.:    WO/2018/105000    International Application No.:    PCT/JP2016/086041
Publication Date: Fri Jun 15 01:59:59 CEST 2018 International Filing Date: Tue Dec 06 00:59:59 CET 2016
IPC: H05K 1/02
H05K 3/00
H05K 3/28
Applicants: MITSUBISHI ELECTRIC CORPORATION
三菱電機株式会社
Inventors: MIURA, Tsuyoshi
三浦 剛
KOJIMA, Tomotaka
小島 知高
Title: PRINTED WIRING BOARD, AIR CONDITIONER, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Abstract:
The purpose of the present invention is to acquire a printed wiring board on which corrosion of a copper foil pattern is effectively prevented. A printed wiring board 1 is provided with: a copper foil pattern 2 on a substrate 1a; a solder resist 3 provided uniformly on the copper foil pattern 2 so as to cover the copper foil pattern 2; and an outline character forming layer 5 provided in a portion where no character is formed such that an outline character is formed on the solder resist 3. In addition, a method for manufacturing the printed wiring board 1 includes: a step for forming the copper foil pattern 2 on the substrate 1a; a step for uniformly forming the solder resist 3, on the copper foil pattern 2, so as to cover the copper foil pattern 2; and a step for forming the outline character forming layer 5 on the solder resist 3, wherein the solder resist 3 is formed by coating according to a spraying method.