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1. (WO2018104969) A SYSTEM AND METHOD FOR ESTABLISHING SOLDERLESS CONNECTION BETWEEN ELECTRICAL AND ELECTRONIC CIRCUITS

Pub. No.:    WO/2018/104969    International Application No.:    PCT/IN2017/050583
Publication Date: Fri Jun 15 01:59:59 CEST 2018 International Filing Date: Sun Dec 10 00:59:59 CET 2017
IPC: H01R 12/00
H05K 3/00
Applicants: MAKERINME TECHNOLOGIES PRIVATE LIMITED
Inventors: RAWLANI, Harish
GULHANE, Parag
Title: A SYSTEM AND METHOD FOR ESTABLISHING SOLDERLESS CONNECTION BETWEEN ELECTRICAL AND ELECTRONIC CIRCUITS
Abstract:
The embodiments herein provide a system and method for providing mechanical stability to solderless electrical connections between electrical and electronic circuits or circuit elements through complementary mechanical coupling. The system improves the characteristics of solderless connection between electrical and electronic circuits by housing the circuits in mechanical connectors. The mechanical connectors are provided with extrusions and cavities to enable mechanical connection between one another. The mechanical connectors and electrical connection pins are placed in such a way that the electrical connecting pins on connectors are also connected to form electrical contact between the circuits affixed on connectors, when connectors are mechanically coupled. The mechanical connector when used in along with electrical pins reduces the connection noise, with no possibility of forming a wrong electrical connection.