The embodiments herein provide a system and method for providing mechanical stability to solderless electrical connections between electrical and electronic circuits or circuit elements through complementary mechanical coupling. The system improves the characteristics of solderless connection between electrical and electronic circuits by housing the circuits in mechanical connectors. The mechanical connectors are provided with extrusions and cavities to enable mechanical connection between one another. The mechanical connectors and electrical connection pins are placed in such a way that the electrical connecting pins on connectors are also connected to form electrical contact between the circuits affixed on connectors, when connectors are mechanically coupled. The mechanical connector when used in along with electrical pins reduces the connection noise, with no possibility of forming a wrong electrical connection.