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1. (WO2018104090) CIRCUIT BOARD DESIGN FOR REDUCING MECHANICAL STRESS

Pub. No.:    WO/2018/104090    International Application No.:    PCT/EP2017/080478
Publication Date: Fri Jun 15 01:59:59 CEST 2018 International Filing Date: Tue Nov 28 00:59:59 CET 2017
IPC: H05K 1/02
H05K 1/11
H05K 3/12
Applicants: CONTI TEMIC MICROELECTRONIC GMBH
Inventors: RUMRICH, Thomas
Title: CIRCUIT BOARD DESIGN FOR REDUCING MECHANICAL STRESS
Abstract:
The invention relates to a circuit board (100) having: a conductive track (120) with a connection region (125); a flexible layer (110) in the connection region (125) of the conductive track (120); and a contact pad (140) which is at least partially provided on the flexible layer (110). The flexible layer (110) is designed to absorb a shear force which is generated by a deformation of the circuit board (100) in order to reduce mechanical stress in the contact pad (140).