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1. (WO2018103163) LOW-MELTING-POINT INORGANIC BINDER SLURRY FOR ALUMINUM SUBSTRATE AND PREPARATION METHOD THEREFOR

Pub. No.:    WO/2018/103163    International Application No.:    PCT/CN2016/113336
Publication Date: Fri Jun 15 01:59:59 CEST 2018 International Filing Date: Sat Dec 31 00:59:59 CET 2016
IPC: H01L 23/29
H01L 21/48
H01B 1/16
H01B 1/22
C03C 8/24
Applicants: DONGGUAN COREHELM ELECTRONIC MATERIALS CO., LTD
东莞珂洛赫慕电子材料科技有限公司
Inventors: LIU, Jian
刘建
SU, Guanxian
苏冠贤
Title: LOW-MELTING-POINT INORGANIC BINDER SLURRY FOR ALUMINUM SUBSTRATE AND PREPARATION METHOD THEREFOR
Abstract:
Low-melting-point inorganic binder slurry for an aluminum substrate and a preparation method therefor. The low-melting-point inorganic binder slurry comprises the following materials in parts by weight: 60-85% of SiO2-Bi2O3-B2O3-Al2O3 low-melting-point inorganic binder, 1-15% of nano aluminum oxide inorganic additive, and 20-40% of organic phase. The low-melting-point inorganic binder slurry for an aluminum substrate can meet packaging and insulation requirements for an aluminum substrate, as well as high requirements for printing precision, film quality, and printing efficiency, can achieve sealing at a low temperature, and has good dielectric insulation performance and good construction performance. The preparation method comprises the following process steps: a) preparing an organic phase; and b) preparing low-melting-point inorganic binder slurry. The preparation method can be effectively produce and prepare the low-melting-point inorganic binder slurry for an aluminum substrate.