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|1. (WO2018103163) LOW-MELTING-POINT INORGANIC BINDER SLURRY FOR ALUMINUM SUBSTRATE AND PREPARATION METHOD THEREFOR|
|Applicants:||DONGGUAN COREHELM ELECTRONIC MATERIALS CO., LTD
|Title:||LOW-MELTING-POINT INORGANIC BINDER SLURRY FOR ALUMINUM SUBSTRATE AND PREPARATION METHOD THEREFOR|
Low-melting-point inorganic binder slurry for an aluminum substrate and a preparation method therefor. The low-melting-point inorganic binder slurry comprises the following materials in parts by weight: 60-85% of SiO2-Bi2O3-B2O3-Al2O3 low-melting-point inorganic binder, 1-15％ of nano aluminum oxide inorganic additive, and 20-40％ of organic phase. The low-melting-point inorganic binder slurry for an aluminum substrate can meet packaging and insulation requirements for an aluminum substrate, as well as high requirements for printing precision, film quality, and printing efficiency, can achieve sealing at a low temperature, and has good dielectric insulation performance and good construction performance. The preparation method comprises the following process steps: a) preparing an organic phase; and b) preparing low-melting-point inorganic binder slurry. The preparation method can be effectively produce and prepare the low-melting-point inorganic binder slurry for an aluminum substrate.