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1. (WO2018103155) FLEXIBLE SUBSTRATE AND MANUFACTURING METHOD THEREFOR

Pub. No.:    WO/2018/103155    International Application No.:    PCT/CN2016/112527
Publication Date: Fri Jun 15 01:59:59 CEST 2018 International Filing Date: Thu Dec 29 00:59:59 CET 2016
IPC: H01L 27/32
H01L 51/56
H01L 51/00
H01L 51/50
Applicants: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
武汉华星光电技术有限公司
Inventors: QIN, Fang
秦芳
Title: FLEXIBLE SUBSTRATE AND MANUFACTURING METHOD THEREFOR
Abstract:
Disclosed are a flexible substrate and a manufacturing method therefor. The flexible substrate comprises a first organic material layer (21) and a second organic material layer (22). The coverage area of the second organic material layer (22) on a support substrate (1) is greater than the coverage area of the first organic material layer (21) on the support substrate (1), and the long side edge of the second organic material layer (22) surrounds the long side edge of the first organic material layer (21), thereby reducing the thickness of the edge of the flexible substrate to prevent etching residues on the edge. The coverage areas of the organic materials on the support substrate (1) are reduced, thereby reducing the warping degree of the flexible substrate. An alignment mark (3) is provided on the second organic material layer (22) between the long side edge of the second organic material layer (22) and the long side edge of the first organic material layer (21), thereby ensuring the alignment precision of subsequent evaporation and other procedures, and since only one layer of organic material exists at the alignment mark (3), the light transmission rate is increased, and the success rate of alignment is increased.