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1. (WO2018103132) HIGH-BONDING STRENGTH COPPER-ALUMINUM COMPOSITE CONDUCTIVE MATERIAL AND PREPARATION METHOD THEREFOR

Pub. No.:    WO/2018/103132    International Application No.:    PCT/CN2016/110430
Publication Date: Fri Jun 15 01:59:59 CEST 2018 International Filing Date: Sat Dec 17 00:59:59 CET 2016
IPC: H01B 1/02
B21C 37/04
Applicants: YAN TAI FISEND BIMETAL CO.,LTD.
烟台孚信达双金属股份有限公司
Inventors: DONG, Xiaowen
董晓文
WANG, Lianzhong
王连忠
Title: HIGH-BONDING STRENGTH COPPER-ALUMINUM COMPOSITE CONDUCTIVE MATERIAL AND PREPARATION METHOD THEREFOR
Abstract:
A high-bonding strength copper-aluminum composite conductive material and a preparation method therefor, comprising a clad copper layer and an aluminum core matrix; an interatomic bonded metallurgical bonding layer is formed between the clad copper layer and the aluminum core matrix; the thickness of the bonding layer ranges from 5 to 35um, and the bonding strength is greater than or equal to 40MPa; a copper-aluminum intermetallic compound is dispersedly distributed in the bonding layer; the components of a diffusion layer close to one side of a copper matrix are uniform, and the thickness of the diffusion layer is narrow; a diffusion layer close to one side of an aluminum matrix is of a reticular structure formed by a mixture of two or more components, and the thickness of the diffusion layer is wide. The bonding between copper and aluminum in the copper-aluminum composite material achieves a metallurgical bonding state, and the corresponding bonding strength is more than 40MPa; the thickness of a side copper layer of the copper-aluminum composite material is about 1.6 to 2 times the thickness of a planar copper layer; the thickness of the side clad copper layer is sufficient enough for large current impact and heat dissipation; and the elongation rate of the copper-aluminum composite material is greater than 30%. The present invention may carry out processing such as torsion, spiraling and side bending which is applied to new fields.