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1. (WO2018102998) METHOD FOR PREPARING CERAMIC PACKAGE SUBSTRATE WITH COPPER PLATING DAMS

Pub. No.:    WO/2018/102998    International Application No.:    PCT/CN2016/108770
Publication Date: Fri Jun 15 01:59:59 CEST 2018 International Filing Date: Thu Dec 08 00:59:59 CET 2016
IPC: H01L 23/15
H01L 23/49
H01L 21/48
Applicants: DONGGUAN CHINA ADVANCED CERAMIC TECHNOLOGY CO., LTD
东莞市国瓷新材料科技有限公司
Inventors: WU, Zhaohui
吴朝晖
Title: METHOD FOR PREPARING CERAMIC PACKAGE SUBSTRATE WITH COPPER PLATING DAMS
Abstract:
A method for preparing a ceramic package substrate with copper plated dams, comprising the steps of (1) thin film metalization; (2) manufacturing independent circuits and annular copper plating layers on a ceramic base; (3) leveling; and (4) plating thickening. Ceramic base circuit layers are manufactured by means of thin film metalization, dry film attachment, exposure and developing, copper plating and leveling, and copper plating dams are manufactured at the periphery of the independent circuits by further repeating dry film attachment, exposure and developing, and plating thickening processes, so that a ceramic package substrate with copper plating dams is obtained.