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1. (WO2018102519) INTEGRATED ATOMIC LAYER DEPOSITION TOOL

Pub. No.:    WO/2018/102519    International Application No.:    PCT/US2017/063891
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Fri Dec 01 00:59:59 CET 2017
IPC: H01L 21/02
C23C 16/455
H01L 21/67
H01L 21/677
Applicants: APPLIED MATERIALS, INC.
Inventors: SRINIVASAN, Mukund
PONNEKANTI, Hari
YUDOVSKY, Joseph
POLYAK, Alexander S.
Title: INTEGRATED ATOMIC LAYER DEPOSITION TOOL
Abstract:
Processing platforms having a central transfer station with a robot, a first batch processing chamber connected to a first side of the central transfer station and a first single wafer processing chamber connected to a second side of the central transfer station, where the first batch processing chamber configured to process x wafers at a time for a batch time and the first single wafer processing chamber configured to process a wafer for about 1/x of the batch time. Methods of using the processing platforms and processing a plurality of wafers are also described.