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1. (WO2018102260) BONDED WAFER METROLOGY

Pub. No.:    WO/2018/102260    International Application No.:    PCT/US2017/063310
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Tue Nov 28 00:59:59 CET 2017
IPC: H01L 21/66
Applicants: KLA-TENCOR CORPORATION
Inventors: SAH, Kaushik
KRAH, Thomas
LI, Shifang
EISENBACH, Heiko
STOERRING, Moritz
Title: BONDED WAFER METROLOGY
Abstract:
Wafer edge profile images are analyzed at locations around a bonded wafer, which may have a top wafer and a carrier wafer. An offset curve is generated based on the wafer edge profile images. Displacement of the top wafer to the carrier wafer is determined based on the offset curve. The wafer edge profile images may be generated at multiple locations around the wafer. The wafer edge profile images may be shadowgram images. A system to determine displacement of the top wafer to the carrier wafer can include an imaging system connected with a controller.