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1. (WO2018102027) COOLING USING ADJUSTABLE THERMAL COUPLING

Pub. No.:    WO/2018/102027    International Application No.:    PCT/US2017/055174
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Thu Oct 05 01:59:59 CEST 2017
IPC: G06F 1/20
H05K 7/20
Applicants: INTEL CORPORATION
Inventors: AOKI, Russell S.
KULKARNI, Devdatta P.
TATE, Alan W.
STEINBRECHER, Robin A.
JENSEN, Ralph W.
Title: COOLING USING ADJUSTABLE THERMAL COUPLING
Abstract:
Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.