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1. (WO2018101821) INTEGRATED CIRCUIT SENSOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Pub. No.:    WO/2018/101821    International Application No.:    PCT/NL2017/050793
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Thu Nov 30 00:59:59 CET 2017
IPC: G01D 11/24
Applicants: SENCIO B.V.
Inventors: VAN DOMMELEN, Ignatius Josephus
Title: INTEGRATED CIRCUIT SENSOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Abstract:
An integrated circuit sensor package (1) with a package body (5) moulded at least in part around a substrate (2) and a plurality of lead frame members (6, 8). The substrate (2) has a first sensor element (3) on a first side surface (2a). The package body (5) comprises an aperture (5a) exposing a sensitive surface (4) of the first sensor element (3). Electrically conductive glue connections (7, 9) are provided between contact terminals of the first sensor element (3) and one or more of the plurality of lead frame members (6, 8).