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1. (WO2018101821) INTEGRATED CIRCUIT SENSOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/101821 International Application No.: PCT/NL2017/050793
Publication Date: 07.06.2018 International Filing Date: 29.11.2017
IPC:
G01D 11/24 (2006.01)
Applicants: SENCIO B.V.[NL/NL]; Transistorweg 7 6534 AT Nijmegen, NL
Inventors: VAN DOMMELEN, Ignatius Josephus; NL
Agent: NEDERLANDSCH OCTROOIBUREAU; P.O. Box 29720 2502 LS The Hague, NL
Priority Data:
201788529.11.2016NL
Title (EN) INTEGRATED CIRCUIT SENSOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
(FR) BOÎTIER DE CAPTEUR DE CIRCUIT INTÉGRÉ ET PROCÉDÉ DE FABRICATION CORRESPONDANT
Abstract: front page image
(EN) An integrated circuit sensor package (1) with a package body (5) moulded at least in part around a substrate (2) and a plurality of lead frame members (6, 8). The substrate (2) has a first sensor element (3) on a first side surface (2a). The package body (5) comprises an aperture (5a) exposing a sensitive surface (4) of the first sensor element (3). Electrically conductive glue connections (7, 9) are provided between contact terminals of the first sensor element (3) and one or more of the plurality of lead frame members (6, 8).
(FR) L'invention concerne un boîtier de capteur de circuit intégré (1) comprenant un corps de boîtier (5) moulé au moins en partie autour d'un substrat (2) et une pluralité d'éléments grille de connexion (6, 8). Le substrat (2) comprend un premier élément capteur (3) sur une première surface latérale (2a). Le corps de boîtier (5) comprend une ouverture (5a) exposant une surface sensible (4) du premier élément capteur (3). Des connexions de colle électriquement conductrices (7, 9) sont situées entre des bornes de contact du premier élément capteur (3) et un ou plusieurs éléments grille de connexion parmi la pluralité d'éléments grille de connexion (6, 8).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)