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1. (WO2018101767) EMS ANTENNA MODULE, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR PACKAGE COMPRISING SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/101767 International Application No.: PCT/KR2017/013910
Publication Date: 07.06.2018 International Filing Date: 30.11.2017
IPC:
H01Q 1/22 (2006.01) ,H01L 23/66 (2006.01) ,H01L 23/522 (2006.01) ,H01L 23/498 (2006.01) ,H01Q 1/24 (2006.01) ,H01Q 1/38 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
1
Details of, or arrangements associated with, aerials
12
Supports; Mounting means
22
by structural association with other equipment or articles
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
58
Structural electrical arrangements for semiconductor devices not otherwise provided for
64
Impedance arrangements
66
High-frequency adaptations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
52
Arrangements for conducting electric current within the device in operation from one component to another
522
including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
498
Leads on insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
1
Details of, or arrangements associated with, aerials
12
Supports; Mounting means
22
by structural association with other equipment or articles
24
with receiving set
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
1
Details of, or arrangements associated with, aerials
36
Structural form of radiating elements, e.g. cone, spiral, umbrella
38
formed by a conductive layer on an insulating support
Applicants: NEPES CO., LTD.[KR/KR]; 105, Geumil-ro 965beon-gil, Samseong-myeon Eumseong-gun Chungcheongbuk-do 27651, KR
Inventors: KWON, Yong-Tae; KR
LEE, Jun-Kyu; KR
LEE, Jae Cheon; KR
Agent: SELIM INTELLECTUAL PROPERTY LAW FIRM; 10F and 11F, Taewoo Bldg., 285, Gangnam-daero Seocho-gu Seoul 06729, KR
Priority Data:
10-2016-016260401.12.2016KR
Title (EN) EMS ANTENNA MODULE, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR PACKAGE COMPRISING SAME
(FR) MODULE D’ANTENNES EMS, SON PROCÉDÉ DE FABRICATION, ET ENSEMBLE SEMI-CONDUCTEUR LE COMPRENANT
(KO) EMS 안테나 모듈 및 그 제조방법과 이를 포함하는 반도체 패키지
Abstract:
(EN) Disclosed are an EMS antenna module and a semiconductor package comprising the same. According to an embodiment of the present invention, the EMS antenna module comprises: a substrate including an antenna pattern and a via hole; a first sealing material on the upper portion of the substrate; and an emission angle adjustment unit for adjusting a signal emission angle of an antenna. A signal transmission speed can be improved by maintaining an optimum emission angle of an antenna signal through the emission angle adjustment unit of the EMS antenna module, and the semiconductor package comprising the same can normally operate while maintaining unique performance against electromagnetic interference.
(FR) L’invention concerne un module d’antennes EMS et un ensemble semi-conducteur le comprenant. Selon un mode de réalisation de la présente invention, le module d’antennes EMS comprend : un substrat incluant un motif d’antenne et un trou d’interconnexion ; un premier matériau étanche sur la partie supérieure du substrat ; et une unité de réglage d’angle d’émission pour le réglage d’un angle d’émission de signaux d’une antenne. Une vitesse d’émission de signaux peut être améliorée en maintenant un angle optimal d’émission d’un signal d’antenne grâce à l’unité de réglage d’angle d’émission du module d’antennes EMS, et l’ensemble semi-conducteur le comprenant peut fonctionner normalement tout en maintenant une performance unique contre l’interférence électromagnétique.
(KO) EMS 안테나 모듈과 이를 포함하는 반도체 패키지가 개시된다. 본 발명의 실시예에 따른 EMS 안테나 모듈은 안테나 패턴과 비아홀을 포함하는 기판과, 기판 상부의 제1 봉지재와, 안테나의 신호 방사각도를 조절하는 방사각 조절부를 포함한다. EMS 안테나 모듈의 방사각 조절부를 통해 안테나 신호의 최적 방사각도를 유지하여 신호 전송속도를 향상시킬 수 있으며, 이를 포함하는 반도체 패키지는 전자파 간섭 또는 장해로부터 고유성능을 유지하면서 정상적으로 동작할 수 있다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)