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1. (WO2018101651) SEMICONDUCTOR ADHESIVE FILM AND SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/101651    International Application No.:    PCT/KR2017/012953
Publication Date: 07.06.2018 International Filing Date: 15.11.2017
IPC:
H01L 23/00 (2006.01), H01L 23/522 (2006.01), H01L 23/31 (2006.01)
Applicants: LG CHEM, LTD. [KR/KR]; 128, Yeoui-daero, Yeongdeungpo-gu, Seoul 07336 (KR)
Inventors: KIM, Hee Jung; (KR).
NA, Nu Ri; (KR).
KIM, Young Kook; (KR).
LEE, Kwang Joo; (KR)
Agent: YOU ME PATENT AND LAW FIRM; 115 Teheran-ro Gangnam-gu Seoul 06134 (KR)
Priority Data:
10-2016-0160379 29.11.2016 KR
Title (EN) SEMICONDUCTOR ADHESIVE FILM AND SEMICONDUCTOR DEVICE
(FR) FILM ADHESIF SEMICONDUCTEUR ET DISPOSITIF À SEMICONDUCTEUR
(KO) 반도체용 접착 필름 및 반도체 장치
Abstract: front page image
(EN)The present invention relates to a semiconductor adhesive film and a semiconductor device comprising the adhesive film, the semiconductor adhesive comprising: a conductive layer comprising one or more selected from the group consisting of copper, nickel, cobalt, iron, stainless steel (SUS), and aluminum, and having a thickness of at least 0.05 μm; and an adhesive layer formed on at least one surface of the conductive layer and comprising a (meth)acrylate-based resin, a curing agent, and an epoxy resin.
(FR)La présente invention concerne un film adhésif semiconducteur et un dispositif à semiconducteur comprenant le film adhésif, l'adhésif semiconducteur comprenant : une couche conductrice comprenant un ou plusieurs éléments choisis dans le groupe constitué par le cuivre, le nickel, le cobalt, le fer, l'acier inoxydable (SUS), et de l'aluminium, et ayant une épaisseur d'au moins 0,05 µm; et une couche adhésive formée sur au moins une surface de la couche conductrice et comprenant une résine à base de (méth) acrylate, un agent de durcissement et une résine époxy.
(KO)본 발명은, 구리, 니켈, 코발트, 철, 스테인레스 스틸(SUS) 및 알루미늄으로 이루어진 군에서 선택된 1종 이상을 포함하고, 0.05 μm 이상의 두께를 갖는 전도성층; 및 상기 전도성층의 적어도 1면에 형성되고, (메트)아크릴레이트계 수지, 경화제 및 에폭시 수지를 포함하는 접착층;을 포함하는, 반도체용 접착 필름과 상기 접착 필름을 포함한 반도체 장치에 관한 것이다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)