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1. (WO2018101583) SLURRY COMPOSITION FOR POLISHING ORGANIC FILM AND METHOD FOR POLISHING ORGANIC FILM USING SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/101583    International Application No.:    PCT/KR2017/009991
Publication Date: 07.06.2018 International Filing Date: 12.09.2017
IPC:
C09G 1/18 (2006.01), B24B 57/02 (2006.01), H01L 21/304 (2006.01), H01L 21/306 (2006.01)
Applicants: SAMSUNG SDI CO., LTD. [KR/KR]; 150-20, Gongse-ro, Giheung-gu Yongin-si Gyeonggi-do 17084 (KR)
Inventors: KIM, Jeong Hee; (KR).
KANG, Dong Hun; (KR).
CHOI, Jung Min; (KR).
YOO, Yong Sik; (KR)
Agent: AJU INTERNATIONAL LAW & PATENT GROUP; 12-13th Floor, Gangnam Mirae Tower, 174 Saimdang-Ro Seocho-Gu Seoul 06627 (KR)
Priority Data:
10-2016-0163103 01.12.2016 KR
Title (EN) SLURRY COMPOSITION FOR POLISHING ORGANIC FILM AND METHOD FOR POLISHING ORGANIC FILM USING SAME
(FR) COMPOSITION DE SUSPENSION ÉPAISSE POUR POLISSAGE DE FILM ORGANIQUE ET PROCÉDÉ DE POLISSAGE DE FILM ORGANIQUE LA METTANT EN OEUVRE
(KO) 유기막 연마용 슬러리 조성물 및 이를 이용한 유기막 연마 방법
Abstract: front page image
(EN)A slurry composition for polishing an organic film of the present invention comprises an oxidant, an organic acid, a polishing accelerator comprising a repeating unit derived from maleic acid or maleic anhydride, and water, wherein the polishing accelerator is included with a smaller weight than the organic acid.
(FR)L'invention concerne une composition de suspension épaisse pour le polissage d'un film organique, comprenant un oxydant, un acide organique, un accélérateur de polissage comprenant une unité récurrente issue d'acide maléique ou d'anhydride maléique, ainsi que de l'eau, l'accélérateur de polissage étant contenu dans un poids inférieur à celui de l'acide organique.
(KO)본 발명의 유기막 연마용 슬러리 조성물은 산화제, 유기산, 말레산 또는 무수말레산으로부터 유래되는 반복단위를 포함하는 연마 가속제 및 물을 포함하고, 상기 연마 가속제는 상기 유기산보다 적은 중량으로 포함된다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)