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|1. (WO2018101573) LIGHT-EMITTING ELEMENT DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR|
|Applicants:||KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
|Inventors:||KIM, Tae Geun
PARK, Ju Hyun
LEE, Byeong Ryong
|Title:||LIGHT-EMITTING ELEMENT DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR|
A light-emitting element display device and a manufacturing method therefor are disclosed. According to the present invention, the light-emitting element display device comprises a light-emitting element array including a plurality of light-emitting elements mutually connected to adjacent light-emitting elements by a plurality of first contact electrodes formed in parallel to each other in a first direction and a plurality of second contact electrodes formed in parallel to each other in a second direction that is orthogonal to the first direction. Herein, a resistance state (switch on/switch off) of each switching element or switching region can be changed and stored by forming a switching element or a switching region formed of a resistance change material between a first contact electrode and a light-emitting element or between a second contact electrode and the light-emitting element, and adjusting a voltage to be applied between the first contact electrode and the second contact electrode. Therefore, according to the present invention, the light-emitting element array can be driven through only changing of a resistance state of a switching element or a switching region, by adjusting a voltage to be applied between a first contact electrode and a second contact electrode, thereby: enabling a display to be driven at low power and at low costs; and a thermal stability problem and a misalign problem of a bump metal, which occur while bonding a conventional light-emitting array on a CMOS substrate by a flip chip scheme, to be solved.