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1. (WO2018101573) LIGHT-EMITTING ELEMENT DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR

Pub. No.:    WO/2018/101573    International Application No.:    PCT/KR2017/008011
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Wed Jul 26 01:59:59 CEST 2017
IPC: H05B 33/12
H05B 33/10
H01L 27/15
H01L 33/42
H01L 33/38
H01L 33/00
H01L 45/00
Applicants: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
고려대학교 산학협력단
Inventors: KIM, Tae Geun
김태근
PARK, Ju Hyun
박주현
LEE, Byeong Ryong
이병룡
Title: LIGHT-EMITTING ELEMENT DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR
Abstract:
A light-emitting element display device and a manufacturing method therefor are disclosed. According to the present invention, the light-emitting element display device comprises a light-emitting element array including a plurality of light-emitting elements mutually connected to adjacent light-emitting elements by a plurality of first contact electrodes formed in parallel to each other in a first direction and a plurality of second contact electrodes formed in parallel to each other in a second direction that is orthogonal to the first direction. Herein, a resistance state (switch on/switch off) of each switching element or switching region can be changed and stored by forming a switching element or a switching region formed of a resistance change material between a first contact electrode and a light-emitting element or between a second contact electrode and the light-emitting element, and adjusting a voltage to be applied between the first contact electrode and the second contact electrode. Therefore, according to the present invention, the light-emitting element array can be driven through only changing of a resistance state of a switching element or a switching region, by adjusting a voltage to be applied between a first contact electrode and a second contact electrode, thereby: enabling a display to be driven at low power and at low costs; and a thermal stability problem and a misalign problem of a bump metal, which occur while bonding a conventional light-emitting array on a CMOS substrate by a flip chip scheme, to be solved.