Search International and National Patent Collections

1. (WO2018101503) METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD MANUFACTURED THEREBY

Pub. No.:    WO/2018/101503    International Application No.:    PCT/KR2016/013949
Publication Date: Fri Jun 08 01:59:59 CEST 2018 International Filing Date: Thu Dec 01 00:59:59 CET 2016
IPC: H05K 3/46
H05K 3/42
H05K 3/24
H05K 1/11
Applicants: KANG, Seongwon
강성원
Inventors: KANG, Seongwon
강성원
Title: METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD MANUFACTURED THEREBY
Abstract:
The present invention relates to a method for manufacturing a printed circuit board and a printed circuit board manufactured thereby and, specifically, to: a method for manufacturing a double-sided or a multi-layered printed circuit board, capable of increasing miniaturization and integration efficiency of the printed circuit board by placing a via hole circuit (via hole pattern) on a surface mount device-pad (SMD-PAD) which is a contact circuit and manufacturing the printed circuit board such that electrical conduction of both sides thereof and component mounting can be simultaneously used; and a printed circuit board manufactured by the manufacturing method. In a configuration of the present invention, provided is a method for manufacturing the printed circuit board, comprising the steps of: (a) forming a blind-via groove (103) by drilling a copper clad laminate (100) in which a copper clad (102) is coated on a double-sided or multi-layered substrate of a substrate insulating body (101), and forming a plated layer (105) by plating copper on the copper clad laminate (100) such that a metal layer of a via-plating groove (104) is electrically conducted with the other surface of the copper clad (102); (b) closely attaching a dry film (106) including a sensitizer to one surface or both surfaces of the copper clad laminate (100) and exposing and developing one surface or both surfaces of the closely attached dry film (106) so as to form an opening part (107) including the via-plating groove (104) on one surface or both surfaces thereof; (c) forming a first metal layer (108) by performing electrolytic copper plating on the opening part (107), and forming a contact circuit (120) on one surface or both surfaces by removing a plating-resist dry film (106a) through a delaminating process; (d) closely attaching a dry film (110) including a sensitizer to both surfaces of the copper clad laminate (100) again and exposing and developing both surfaces of the closely attached dry film (110) to form, on the both surfaces of the closely attached dry film (110), an etching-resist dry film (110a) on which a connection circuit is to be formed; and (e) etching a copper clad surface except for the etching-resist dry film (110a) and removing the etching-resist dry film (110a) through a delaminating process to form, on both surfaces, a connection circuit (130) including the connection circuit (120) on one surface or both surfaces thereof. In addition, the present invention also provides a printed circuit board manufactured by the manufacturing method.